Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

1. A wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer,

all or a part of the side surface of said second electrode does not make contact with said insulation layer, and

the surface of said second electrode that is exposed toward said second surface is in the same plane as said second surface.

2. The wiring board according to claim 1 , wherein said first electrode and said second electrode are directly connected.

3. A semiconductor device comprising:

the wiring board according to claim 1 ; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board.

4. The semiconductor device according to claim 3 , wherein

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

5. The wiring board according to claim 1 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

6. The wiring board according to claim 1 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

7. A wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer,

all or a part of the side surface of said second electrode does not make contact with said insulation layer, and

the surface of said second electrode that is exposed toward said second surface is recessed with respect to said second surface.

8. The wiring board according to claim 7 , wherein said first electrode and said second electrode are directly connected.

9. A semiconductor device comprising:

the wiring board according to claim 7 ; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board.

10. The semiconductor device according to claim 9 , wherein:

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

11. The wiring board according to claim 7 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

12. The wiring board according to claim 7 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

13. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is flip-chip connected to said first electrode and/or said second electrode by using a material comprising a low-melting metal or an electroconductive resin, and

wherein the surface of said second electrode that is exposed toward said second surface is in the same plane as said second surface.

14. The semiconductor device according to claim 13 , wherein:

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

15. The semiconductor device according to claim 13 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

16. The semiconductor device according to claim 13 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

17. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is connected by wire bonding to said first electrode and/or said second electrode by using a wire in which the primary metal is gold, and

wherein the surface of said second electrode that is exposed toward said second surface is in the same plane as said second surface.

18. The semiconductor device according to claim 17 , wherein:

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

19. The semiconductor device according to claim 17 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

20. The semiconductor device according to claim 17 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

21. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is connected to said wiring board by using at least one material selected from a group consisting of a low-melting metal, an organic resin, and a metal-containing resin, and

wherein the surface of said second electrode that is exposed toward said second surface is in the same plane as said second surface.

22. The semiconductor device according to claim 21 , wherein:

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

23. The semiconductor device according to claim 21 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

24. The semiconductor device according to claim 21 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

25. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein a metal ball comprising a solder material is provided to said first electrode and/or said second electrode, and

wherein the surface of said second electrode that is exposed toward said second surface is in the same plane as said second surface.

26. The semiconductor device according to claim 25 , wherein:

said first electrode and said second electrode are directly connected, one or a plurality of semiconductor elements is connected to said first electrode; and

one or a plurality of semiconductor elements is connected to said second electrode.

27. The semiconductor device according to claim 25 , wherein:

said insulation layer is a single layer,

said wiring layer is a single layer,

said wiring layer is disposed on said insulation layer and said second electrode, and

said first electrode is disposed on said insulation layer and said second electrode.

28. The semiconductor device according to claim 25 , wherein:

said wiring board comprises a plurality of insulation layers,

said wiring board comprises a plurality of wiring layers,

said plurality of insulation layers and said plurality of wiring layers are alternately laminated, and

said plurality of wiring layers are connected to each other by vias disposed within said insulation layers.

29. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is flip-chip connected to said first electrode and/or said second electrode by using a material comprising a low-melting metal or an electroconductive resin, and

wherein the surface of said second electrode that is exposed toward said second surface is recessed with respect to said second surface.

30. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is connected by wire bonding to said first electrode and/or said second electrode by using a wire in which the primary metal is gold, and

wherein the surface of said second electrode that is exposed toward said second surface is recessed with respect to said second surface.

31. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein said semiconductor element is connected to said wiring board by using at least one material selected from a group consisting of a low-melting metal, an organic resin, and a metal-containing resin, and

wherein the surface of said second electrode that is exposed toward said second surface is recessed with respect to said second surface.

32. A semiconductor device comprising:

a wiring board comprising:

at least a single insulation layer and at least a single wiring layer;

a first surface and a second surface;

a first electrode disposed on said first surface; and

a second electrode disposed on said second surface;

wherein:

the second electrode disposed on said second surface is embedded in said insulation layer,

the surface of said second electrode on the side opposite the surface exposed toward said second surface is connected to said wiring layer, and

all or a part of the side surface of said second electrode does not make contact with said insulation layer; and

one or a plurality of semiconductor elements connected to said first electrode and/or said second electrode in the wiring board,

wherein a metal ball comprising a solder material is provided to said first electrode and/or said second electrode, and

wherein the surface of said second electrode that is exposed toward said second surface is recessed with respect to said second surface.