Patent Assignment
Reel/Frame 030783/0873
Assignment of Assignor's Interest
Recorded: 2013-07-12
Pages: 4
Assignor
NEC CORPORATION
Executed: 2013-06-21
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(26)
Method for Laminating and Mounting Semiconductor Chip
Semiconductor Photo-Detecting Element
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device
Semiconductor Device Having High Dielectric Constant Layers of Different Thicknesses
Wiring Substrate for Mounting Semiconductors, Method of Manufacturing the Same, and Semiconductor Package
Semiconductor Device
Interconnecting Substrate and Semiconductor Device
Wiring Board and Method for Manufacturing the Same
Wiring Board, Method for Manufacturing Same, and Semiconductor Package
Organic Insulating Film, Manufacturing Method Thereof, Semiconductor Device Using Such Organic Insulating Film and Manufacturing Method Thereof
Wiring Board, Semiconductor Device in Which Wiring Board Is Used, and Method for Manufacturing the Same
Multilayered Wiring Board, Semiconductor Device in Which Multilayered Wiring Board Is Used, and Method for Manufacturing the Same
Wiring Board, Semiconductor Device, and Method of Manufacturing the Same
Transsistor with Heat Dissipating Means
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device and Method for Manufacturing Same
Semiconductor Device and Method of Manufacturing Same
Semiconductor Device and Method of Manufacturing Same
Wiring Board, Semiconductor Device Using Wiring Board and Their Manufacturing Methods
Wiring Boad, Semiconductor Device in Which Wiring Board Is Used, and Method for Manufaturing the Same
Semiconductor Device and Method of Manufacturing the Same
Wiring Substrate for Mounting Semiconductors, Method of Manufacturing the Same, and Semiconductor Package
Wiring Board, Semiconductor Device, and Method of Manufacturing the Same
Method of Manufacturing a Wiring Board
Semiconductor Device and Method for Manufacturing the Same
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 9, 2010
From: KIMIZUKA, NAOHIKO; IMAI, KIYOTAKA; MASUOKA, YURI; IWAMOTO, TOSHIYUKI
To: NEC CORPORATION
Reel/Frame 024208/0751 →
Change of Name
Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0696 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0851 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0869 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0815 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0842 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0886 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0868 →
Change of Name
Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0145 →
Merger
Jul 12, 2013
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0796 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →