Patent Assignment
Reel/Frame 025214/0696
Change of Name
Recorded: 2010-10-28
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Device
Application:
12/103,729 →
Publication:
US 2008/0315277
Output Circuit
Semiconductor Device
Image Output Apparatus and Image Display Apparatus
Application:
12/104,835 →
Publication:
US 2008/0259011
Semiconductor Device
Interface Circuit
Scene Change Detection Device, Coding Device, and Scene Change Detection Method
Application:
12/108,537 →
Publication:
US 2008/0266457
Semiconductor Device
Semiconductor Device and Method of Fabricating the Same
Application:
12/111,352 →
Publication:
US 2008/0203572
Data Processing and Management Equipment and Method for Data Analysis of Particles in Surface Structuring Device or Film Forming Device
Regulator Circuit Having Over-Current Protection
Semiconductor Device and Method of Manufacturing the Same
Voltage Sensor Module and Voltage Monitoring Apparatus
Liquified Gas Supply System and Method Thereof
Method of Manufacturing Semiconductor Device to Decrease Defect Number of Plating Film
Application:
12/118,979 →
Publication:
US 2008/0283404
Semiconductor Device and Method of Blowing Fuse Thereof
Semiconductor Device and Method of Manufacturing the Same
Application:
12/127,149 →
Publication:
US 2008/0296779
Chemically Amplified Resist Composition and Manufacturing Method of Semiconductor Integrated Circuit Device with Such Chemically Amplified Resist Composition
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Apparatus and Method of Manufacturing Semiconductor Apparatus
Semiconductor Device
Lead Frame and Manufacturing Method Thereof, and Semiconductor Apparatus and Manufacturing Method Thereof
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having a Photoelectric Conversion Function and Sealed with Sealing Resins
Application:
12/130,228 →
Publication:
US 2008/0296750
Semiconductor Device Having Semiconductor Chip and Antenna
Application:
12/131,216 →
Publication:
US 2008/0296745
Delay Circuit with Reference Pulse Generator to Reduce Variation in Delay Time
Pal Signal Demodulating Apparatus
Processor Apparatus with Instruction Set for Storing Comparison Conditions and for Evaluating Branch Condition Values Against Results of Identified Complrx Comparison Consitions
Phase Lock Loop Semiconductor Device
Method for Manufacturing Semiconductor Device, and Method for Processing Etching-Target Film
Semiconductor Device and Method for Manufacturing Same
Image Sensor Array Architecture for Improved Resolution Switching
Method of Evaluating Thermal Stress Resistance of Semiconductor Device, and Semiconductor Wafer Having Test Element
Method for Manufacturing Semiconductor Device and Semiconductor Device
Wiring Board and Semiconductor Package Using the Same
Flyback Voltage Detecting Circuit, Apparatus and Method for Inductive Load
Application:
12/142,432 →
Publication:
US 2008/0316666
Test Apparatus, Pattern Generator, Test Method and Pattern Generating Method
Dma Transfer Control Device and Method of Dma Transfer
Application:
12/146,102 →
Publication:
US 2009/0006669
Chopper Type Dc-Dc Converter
Semiconductor Device
Semiconductor Device Having Metal Cap Divided by Slit
Switching Regulator and Method of Converting Dc Voltage
Delayed Decision Feedback Sequence Estimator
Debugging System and Method Including an Emulator for Debugging a Target Device
Current Source Circuit and Method of Outputting Current
Static Random Access Memory Device
Noise detection circuit
Application:
12/149,501 →
Publication:
US 2008/0283876
Display Apparatus and Display Panel Driver Including Subtractive Color Processing Circuit for Error Diffusion Processing and Weighting Processing
Clock Generator
Electrostatic Protection Circuit
Test Circuit
Method of Verifying Semiconductor Integrated Circuit and Design Program
Switching Regulator Having Reverse Current Detector
Semiconductor Integrated Circuit Device Having Fail-Safe Mode and Memory Control Method
Apparatus and method for cooperation verification
Application:
12/149,993 →
Publication:
US 2008/0288231
Lcd Controller and Lcd Control Method
Otp Memory Cell, Otp Memory, and Method of Manufacturing Otp Memory Cell
Semiconductor Device and Method for Manufacturing the Same
Semiconductor Device
Motor Control Microcomputer and Control Method for the Same
Semiconductor Integrated Circuit and Method of Designing Thereof Based on Tpi
Semiconductor chip
Application:
12/153,665 →
Publication:
US 2008/0294818
Semiconductor Device That Uses a Plurality of Source Voltages
High-Frequency Signal Detector
Semiconductor element and method of manufacturing the same
Application:
12/153,878 →
Publication:
US 2008/0296765
Packet transmission device and packet transmission method
Application:
12/153,974 →
Publication:
US 2008/0301537
Semiconductor Device
Semiconductor device
Application:
12/155,060 →
Publication:
US 2008/0296723
Power consumption calculating method
Application:
12/155,082 →
Publication:
US 2008/0300806
Semiconductor memory device and test method therefor
Application:
12/155,240 →
Publication:
US 2008/0298148
Sound Processor
Input/Output Circuit
Semiconductor Device
Resistance net generating apparatus for circuit simulation
Application:
12/155,284 →
Publication:
US 2008/0313586
Selectively Debugging Processor Cores Through Instruction Codes
Branch Prediction Control Device Having Return Address Stack and Method of Branch Prediction
Triangular Wave Generator
Bandgap circuit
Application:
12/155,497 →
Publication:
US 2009/0001958
Monitoring Device and Monitoring Method for Monitoring Data Held in Memory
Semiconductor Device
Semiconductor Memory Device, Method of Writing Data Therein, and Method of Reading Data Therefrom
Semiconductor Memory Device Having Memory Cell and Reference Cell Connected to Same Sense Amplifier and Method of Reading Data Thereof
Amplifier Circuit, Digital-to-Analog Conversion Circuit, and Display Device
Semiconductor integrated circuit, layout design method of semiconductor integrated circuit, and layout program product for same
Application:
12/155,654 →
Publication:
US 2008/0309374
Semiconductor Device
Display controller and method of controlling the same
Application:
12/155,710 →
Publication:
US 2009/0009507
Bias Circuit Having Second Current Path to Bandgap Reference During Power-On
USB host, USB slave, wireless communication system, and data transfer method
Application:
12/155,713 →
Publication:
US 2008/0320180
Semiconductor Memory Device
Display unit and display panel driver including operational amplifier to apply reference voltage to resistance ladder having impedance adjusting circuit
Application:
12/155,992 →
Publication:
US 2009/0009537
Mosfet, Method of Fabricating the Same, Cmosfet, and Method of Fabricating the Same
Application:
12/159,295 →
Publication:
US 2010/0219478
Multilayered Circuit Board with Second via Made from Second Material
Application:
12/160,132 →
Publication:
US 2009/0046441
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2008
From: NAKASHIBA, YASUTAKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020809/0312 →
Assignment of Assignor's Interest
Apr 16, 2008
From: KANAMARU, JIRO; AKIOKA, TOSHIAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020812/0963 →
Assignment of Assignor's Interest
Apr 17, 2008
From: HAYASHI, NAOKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020819/0297 →
Assignment of Assignor's Interest
Apr 17, 2008
From: EJIMA, DAISUKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020818/0107 →
Assignment of Assignor's Interest
Apr 23, 2008
From: KURITA, YOICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020841/0684 →
Assignment of Assignor's Interest
Apr 24, 2008
From: SASAKURA, YASUAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020848/0037 →
Assignment of Assignor's Interest
Apr 24, 2008
From: INOSE, HIROSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020848/0017 →
Assignment of Assignor's Interest
Apr 29, 2008
From: MIURA, YOSHINAO; NINOMIYA, HITOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020871/0129 →
Assignment of Assignor's Interest
Apr 29, 2008
From: KUROKAWA, TETSUYA; ARITA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020871/0497 →
Assignment of Assignor's Interest
May 1, 2008
From: KAWASHIMA, SHINJI; DOI, KAZUNORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020887/0432 →
Assignment of Assignor's Interest
May 1, 2008
From: SUGIMOTO, MASAAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020883/0357 →
Assignment of Assignor's Interest
May 2, 2008
From: KURITA, YOICHIRO; KAWANO, MASAYA; SOEJIMA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020893/0784 →
Assignment of Assignor's Interest
May 9, 2008
From: SUGAWARA, ICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020925/0210 →
Assignment of Assignor's Interest
May 12, 2008
From: FURUYA, AKIRA; KOZUMI, SHINSUKE; ARITA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020934/0380 →
Assignment of Assignor's Interest
May 22, 2008
From: FURUKAWA, HIROYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020984/0031 →
Assignment of Assignor's Interest
May 27, 2008
From: MATSUI, SATOSHI; KURITA, YOICHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021000/0638 →
Assignment of Assignor's Interest
May 28, 2008
From: KAWANO, MASAYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021045/0780 →
Assignment of Assignor's Interest
May 28, 2008
From: NAGAHARA, SEIJI; WATANABE, SATOSHI; MAEDA, KAZUNORI
To: NEC ELECTRONICS CORPORATION; SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 021008/0690 →
Corrective Assignment to Correct the Erroneously Recorded Serial Number from 12-177,375 to 12-117,375. Document Previously Recorded at Reel 021373 Frame 0067.
Nov 20, 2008
From: MIYAMOTO, MANABU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 021873/0218 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →