Semiconductor device and method of manufacturing the same
View Patent ↗A semiconductor device is manufactured by forming a hole as being extended through a first insulating film and an insulating interlayer stacked over a semiconductor substrate, allowing side-etching of the inner wall of the hole to proceed specifically in a portion of the insulating interlayer, to thereby form a structure having the first insulating film projected out from the edge towards the center of the hole; forming a lower electrode film as being extended over the top surface, side face and back surface of the first insulating film, and over the inner wall and bottom surface of the hole; filling a protective film in the hole; removing the lower electrode film specifically in portions fallen on the top surface and side face of the first insulating film; removing the protective film; and forming a cylindrical capacitor in the hole.
1. A semiconductor device, comprising:
a semiconductor substrate;
an insulating interlayer formed over said semiconductor substrate;
a first insulating film formed over said insulating interlayer; and
a cylindrical capacitor filling a hole formed as being extended through said insulating interlayer and said first insulating film,
wherein said first insulating film is configured as being projected out from the edge towards the center of said hole,
said cylindrical capacitor is configured as having a lower electrode film, a capacitor insulating film and an upper electrode stacked in this order,
the top surface of said lower electrode film is covered by the projected portion of said first insulating film at the upper portion of said hole, and
end surfaces of said first insulating film are aligned with end surfaces of said capacitor insulating film and with end surfaces of said upper electrode.
2. The semiconductor device as claimed in claim 1 , wherein said insulating interlayer is a silicon oxide film.
3. The semiconductor device as claimed in claim 1 , wherein said first insulating film is a nitride film.
4. The semiconductor device as claimed in claim 1 , configured as further having a second insulating film and a third insulating film stacked in this order between said semiconductor substrate and said insulating interlayer, and said second insulating film and third insulating film have a contact formed therein connected to said lower electrode film.