Assignment of Assignor's Interest

Recorded: 2008-05-12 Pages: 3

Assignors

FURUYA, AKIRA

Executed: 2008-05-07

KOZUMI, SHINSUKE

Executed: 2008-05-07

ARITA, KOJI

Executed: 2008-05-07

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device to Decrease Defect Number of Plating Film

Application: 12/118,979 →

Publication: US 2008/0283404

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.