Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof
View Patent ↗The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.
1. A lead frame, comprising:
a plurality of mounting portions on which a semiconductor element is mounted;
a plurality of electrodes to which said semiconductor element mounted on the respective mounting portion is electrically connected;
a corner portion which connects said plurality of mounting portions, and which has a hanging lead piece that supports said mounting portions and an electrode connection piece that connects said plurality of electrodes; and
a half-blanking portion having a concave portion that is formed in a thickness direction and a protrusion that is formed at a position corresponding to said concave portion, and which is covered with a sealing resin material that seals said semiconductor element;
wherein a stress-dispersing portion for dispersing a stress that arises, when said half-blanking portion is formed, is provided in said corner portion.
2. The lead frame according to claim 1 , wherein said stress-dispersing portion has a plurality of beams that connect said hanging lead piece and said electrode connection piece in an arc shape, and is formed in an annular shape in which said plurality of beams are connected.
3. The lead frame according to claim 1 , wherein said half-blanking portion is formed in said mounting portion, said hanging lead piece, and said electrode connection piece, respectively.
4. The lead frame according to claim 1 , wherein a depth in said thickness direction of said concave portion of said half-blanking portion is within a minimum/maximum range of 40% to 65%.
5. The lead frame according to claim 1 , wherein, at a cross section which, in said thickness direction, intersects a boundary of said half-blanking portion, a cross-sectional area per unit length of a portion intersecting said boundary is substantially equal to a cross-sectional area per unit length of a portion that does not intersect said boundary.
6. The lead frame according to claim 1 , wherein, in said half-blanking portion, a side wall in said thickness direction of said concave portion and said protrusion is inclined with respect to said thickness direction.
7. A semiconductor apparatus, comprising a lead frame according to claim 1 , wherein said semiconductor element is mounted in said lead frame, and a sealing resin material seals said semiconductor element.