SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA
A semiconductor device comprises a lead frame, an antenna formed at a predetermined position on the lead frame, and a semiconductor chip. The semiconductor chip is mounted on an island of the lead frame through a spacer.
1 . A semiconductor device comprising:
a lead frame;
an antenna formed at a predetermined position on said lead frame; and
a semiconductor chip mounted on an island of said lead frame through a spacer.
2 . The semiconductor device according to claim 1 ,
wherein said spacer is made of insulating material.
3 . The semiconductor device according to claim 2 ,
wherein material of said spacer includes any of glass, ceramic and silicon.
4 . The semiconductor device according to claim 3 ,
wherein material of said spacer is glass.
5 . The semiconductor device according to claim 1 ,
wherein said spacer is bonded to said island and said semiconductor chip with adhesive.
6 . The semiconductor device according to claim 2 ,
wherein material of said spacer is molding compound.
7 . The semiconductor device according to claim 1 ,
wherein a thickness of said spacer is not less than 1 mm.
8 . The semiconductor device according to claim 1 ,
wherein said semiconductor chip is electrically connected to a lead electrode of said lead frame through a bonding wire.
9 . The semiconductor device according to claim 1 ,
wherein said semiconductor chip is a first semiconductor chip, said semiconductor device further comprising a second semiconductor chip electrically connected to said antenna,
wherein said second semiconductor chip communicates with an external device by using said antenna.
10 . The semiconductor device according to claim 9 ,
wherein said antenna is a slit antenna formed on said lead frame, and said second semiconductor chip is so placed as to straddle a slit of said slit antenna.
11 . A semiconductor device comprising:
a lead frame;
a first semiconductor chip placed on a first position of said lead frame; and
a second semiconductor chip placed on an antenna that is formed at a second position of said lead frame,
wherein a distance between said first semiconductor chip and said lead frame is larger than a distance between said second semiconductor chip and said lead frame.