Patent Assignment
Reel/Frame 025311/0842
Change of Name
Recorded: 2010-11-04
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Integrated Circuit and Device and Method for Testing the Circuit
Semiconductor Integrated Device and Apparatus for Designing the Same
Stream processor including DMA controller used in data processing apparatus
Application:
11/445,132 →
Publication:
US 2006/0277545
Program Creation Apparatus, Program Creation Method and Program
Semiconductor Device Having Resin-Sealed Area on Circuit Board Thereof
Non-Destructive Testing Apparatus and Non-Destructive Testing Method
Liquid Crystal Display Control Circuit
Method for Manufacturing Semiconductor Device and Semiconductor Device
Semiconductor Device with a Diffusion Barrier Film Having a Spacing for Stress Relief of Solder Bump
Level Conversion Circuit with Duty Correction
Semiconductor Device and Method for Manufacturing Semiconductor Device
Variable Gain Amplifier Circuit, Method of Correcting Dc Offset of the Variable Gain Amplifying Circuit, and Radio Receiving Apparatus
Wiring Board and Method for Manufacturing the Same
Liquid Crystal Displaying Apparatus Using Data Line Driving Circuit
Semiconductor Device for Reducing Soft Error Rate with Reduced Power Consumption
Semiconductor Device and Manufacturing Method Therefor
Pll Circuit and Semiconductor Device Provided with Pll Circuit
Semiconductor Integrated Circuit Device
Method for treating vapor deposition apparatus, method for depositing thin film, vapor deposition apparatus and computer program product for achieving thereof
Application:
11/452,247 →
Publication:
US 2006/0280868
Wiring Board, Method for Manufacturing Same, and Semiconductor Package
Non-Volatile Semiconductor Memory Device
Semiconductor Memory Device Having Redundancy Circuit for Replacing a Defective Part
Loop Communication System and Communication Device
Semiconductor Device and Test Method Thereof
Semiconductor Device Including Diffusion Layer Formed in Drift Region Disposed Apart from Base Region
Dead Time Control Circuit Capable of Adjusting Temperature Characteristics of Dead Time
Anti-Noise Input/Output Impedance Control of Semiconductor Circuit with Reduced Circuit Size
Processor and Method of Controlling Execution of Processes
Oscillator Circuit and Integrated Circuit Incorporating the Same
Driver Unit Including Common Level Shifter Circuit for Display Panel and Nonvolatile Memory
Polysilicon Film with Increased Roughness
Decoding Device and Decoding Method and Program
Decoder Device and Decoding Method and Program
Driving Circuit, Display Device, and Driving Method for the Display Device
Method of Manufacturing Semiconductor Device
Carbon Containing Silicon Oxide Film Having High Ashing Tolerance and Adhesion
Capacitor Cell, Semiconductor Device and Process for Manufacturing the Same
Apparatus and Method for Generating Transistor Model
Semiconductor Device Containing Charge Pump Type Step-Up Circuit Featuring Bipolar Transistor for Carrying Out Initial Charging
Semiconductor Apparatus and Method of Manufacturing the Same
Semiconductor Circuit and Resistance Value Controlling Method
Test Circuit and Test Method
Power Supply Apparatus Including Charge-Pump Type Step-Up Circuit Having Different Discharging Time Constants
Electronic Service Providing System, Terminal, Wireless Tag Providing Apparatus, and Server Device
Semiconductor Integrated Circuit Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device with a Super-Junction
Overvoltage Protection Circuit
Method and Apparatus for Detecting Abnormal Characteristic Values Capable of Suppressing Detection of Normal Characteristic Values
Method and Device for Alternately Decoding Data in Forward and Reverse Directions
Display Apparatus, Data Line Driver, and Display Panel Driving Method
Semiconductor Device
Semiconductor Device Guard Ring
Field Effect Transistor
Method for Controlling Nonvolatile Memory Device
Semiconductor Integrated Circuit Device
Semiconductor Device and Method of Manufacturing the Same
Solid-State Imaging Apparatus
Semiconductor Device Having a Shared Contact and Method of Fabricating the Same
Semiconductor Device and Method of Manufacturing the Same
Serial-To-Parallel Conversion/Parallel-to-Serial Conversion/ Fifo Unified Circuit
Impedance Adjusting Circuit and Impedance Adjusting Method
Apparatus and Method for Detecting Data Error
Switch Circuit
Nonvolatile Memory Semiconductor Device and Method for Manufacturing Same
Power-Source Potential Control Circuit and Method of Trimming Power-Source Potential
Pre-Emphasis Circuit
Interface Circuit and Semiconductor Device
Error Detecting Code Calculation Circuit, Error Detecting Code Calculation Method, and Recording Apparatus
Semiconductor Package Featuring Metal Lid Member
Booster Circuit Including an Oscillator
Method for Manufacturing Semiconductor Device and Semiconductor Device
Semiconductor Device Including a Memory Unit and a Logic Unit
Optical Module with Flexible Substrate
Dsv Control Apparatus and Dsv Control Method
Output Buffer Circuit with De-Emphasis Function
Switch Circuit
Method of Semiconductor Device and Design Supporting System of Semiconductor Device
Semiconductor Storage Device and Method of Manufacturing the Same
Interface Circuit
Vertical power mosfet semiconductor apparatus having separate base regions and manufacturing method thereof
Application:
11/500,332 →
Publication:
US 2007/0045700
Output Buffer Circuit
Semiconductor Device and Method of Manufacturing the Same
Method for manufacturing semiconductor device
Application:
11/503,203 →
Publication:
US 2007/0048921
Receiver Capable of Increasing Operation Speed with Suppressing Increase of Power Consumption
Display control apparatus capable of decreasing the size thereof
Application:
11/503,920 →
Publication:
US 2007/0040855
Semiconductor Device Having Separated Drain Regions
Semiconductor Memory Device Having Reference Transistor and Method of Manufacturing the Same
Semiconductor Device Having Electrical Fuse
Differential Output Circuit with Stable Duty
Semiconductor Device
Semiconductor Device
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 1, 2006
From: FUJII, KUNINOBU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017959/0414 →
Assignment of Assignor's Interest
Jun 2, 2006
From: TOGAWA, KATSUMI; ANJO, KENICHIRO; FUJII, TARO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017961/0388 →
Assignment of Assignor's Interest
Jun 5, 2006
From: GUNJI, TAKAHISA; MAEDA, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017974/0396 →
Assignment of Assignor's Interest
Jun 6, 2006
From: MATSUDA, SHUICHI
To: NEC CORPORATION
Reel/Frame 017976/0218 →
Assignment of Assignor's Interest
Jun 6, 2006
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017976/0648 →
Assignment of Assignor's Interest
Jun 7, 2006
From: NIKAWA, KIYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017958/0783 →
Assignment of Assignor's Interest
Jun 7, 2006
From: SUZUKI, TATSUYA; AOKI, HIDEMITSU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017984/0465 →
Assignment of Assignor's Interest
Jun 7, 2006
From: YAMADA, YUKIKO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017984/0444 →
Assignment of Assignor's Interest
Jun 7, 2006
From: NAGATO, HIDEKAZU; MIYAZAKI, KIYOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017984/0289 →
Assignment of Assignor's Interest
Jun 7, 2006
From: SAKAI, SHINGO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017958/0940 →
Assignment of Assignor's Interest
Jun 8, 2006
From: OHBA, HIDEO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017985/0555 →
Assignment of Assignor's Interest
Jun 9, 2006
From: YOKOTA, JUNYA; HASHIMOTO, YOSHIHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017969/0476 →
Assignment of Assignor's Interest
Jun 9, 2006
From: KIKUCHI, KATSUMI; YAMAMICHI, SHINTARO; MURAI, HIDEYA; FUNAYA, TAKUO
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 017989/0160 →
Assignment of Assignor's Interest
Jun 12, 2006
From: NISHIDA, TAKAYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017985/0876 →
Assignment of Assignor's Interest
Jun 12, 2006
From: TASHIRO, TOMONARI; HACHIGO, TAKETO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017969/0363 →
Assignment of Assignor's Interest
Jun 12, 2006
From: IWAYA, YUICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017991/0038 →
Assignment of Assignor's Interest
Jul 12, 2006
From: TAKAGI, NAOHIRO; SUZUKI, YASUHIRO; SATOU, KAZUAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 018098/0893 →
Assignment of Assignor's Interest
Jul 12, 2013
From: NEC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 030783/0873 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Change of Name
Mar 2, 2023
From: OPNA IMMUNO-ONCOLOGY SA
To: OPNA BIO SA
Reel/Frame 062856/0846 →