Semiconductor device and manufacturing method therefor
View Patent ↗The semiconductor device according to an aspect of the invention includes: an internal circuit area having an internal circuit; an I/O circuit area positioned outside the internal circuit area; and an electrode pad placed across an outer edge of the I/O circuit area. In the electrode pad, an area outside the outer edge of the I/O circuit area is a bonding area, and an area inside the outer edge is a probe area.
1. A semiconductor device comprising:
a semiconductor substrate;
at least one internal circuit and I/O circuit areas; and
an electrode pad formed above said semiconductor substrate and having a first portion and a second portion, said second portion for wire bonding,
wherein said I/O circuit areas are formed only under said first portion of said electrode pad and not formed under said second portion of said electrode pad there being only insulation between said second portion of said electrode pad and said substrate, there being no portions of said internal circuit or any of said I/O circuits under said second portion.
2. The semiconductor device according to claim 1 , further comprising:
a transistor structural part formed on said semiconductor substrate for forming at least a transistor, and said transistor structural part formed under said first portion and not under said second portion.
3. The semiconductor device according to claim 1 , further comprising:
an insulating film formed between said electrode pad and said line structural part, said insulating film formed under said first and second portions.
4. A semiconductor device according to claim 1 , wherein said second portion of said electrode pad is connected to a bonding wire.
5. The semiconductor device according to claim 2 , further comprising:
an insulating film formed between said line structural part and said transistor structural part.
6. A semiconductor device comprising:
a semiconductor substrate;
at least one internal circuit and I/O circuit areas;
a transistor structural part formed on said semiconductor substrate for forming at least a transistor; and
an electrode pad formed above said transistor structural part, and having a first portion and a second portion, said second portion for a wire bonding, said transistor structural part formed under only said first portion and not under said second portion,
wherein there is only insulation between said second portion of said electrode pad and said substrate.
7. The semiconductor device according to claim 6 , further comprising:
a line structural part formed under said electrode pad and having at least a line, said line structural part formed under said first portion and not under said second portion.
8. The semiconductor device according to claim 7 , further comprising:
an insulating film formed between said line structural part and said transistor structural part.
9. The semiconductor device according to claim 7 , further comprising:
an insulating film formed between said electrode pad and said line structural part, said insulating film formed under said first and second portions.