Patent Assignment
Reel/Frame 017984/0444
Assignment of Assignor's Interest
Recorded: 2006-06-07
Pages: 2
Assignor
YAMADA, YUKIKO
Executed: 2006-05-29
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device with a Diffusion Barrier Film Having a Spacing for Stress Relief of Solder Bump
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.