IP Library Granted Patent US 7,492,569
Granted Patent B2
US 7,492,569 · App. 11/477,383 · Granted Feb 17, 2009

Capacitor cell, semiconductor device and process for manufacturing the same

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Quick Facts
Patent No.
US 7,492,569
App. No.
11/477,383
Granted
Feb 17, 2009
Kind
B2
Abstract

A capacitor cell for reducing noise in a high drive cell includes a plurality of vias for supplying power to an interconnection layer positioned over the capacitor cell from an upper interconnection layer, so that the resistance of the power supply path is reduced.

Claims (20)

1. A semiconductor device comprising:

a capacitor cell formed on said semiconductor substrate, including at least one capacitor element;

one interconnection layer positioned over said capacitor cell;

at least one other interconnection layer different from said one interconnection layer, on which a power supply line is provided;

at least one power supply line disposed on said one interconnection layer at an area corresponding to the area at which said capacitor cell is placed, said power supply line being electrically connected to corresponding said power supply line on said other interconnection layer through at least one connecting via; and

a cell disposed in the vicinity of said capacitor cell having a circuit including at least one active element;

wherein said capacitor cell constitutes a decoupling capacitor of said cell disposed in the vicinity of said capacitor cell;

wherein said power supply line provided on said one interconnection layer at an area corresponding to the area where said capacitor cell is disposed constitutes a power supply path to said cell; and

wherein said capacitor cell is placed on one or both sides of adjacent column on which said cell is disposed on the same row as the row on which said cell is disposed.

2. A semiconductor device comprising:

a capacitor cell formed on said semiconductor substrate, including at least one capacitor element;

one interconnection layer positioned over said capacitor cell;

at least one other interconnection layer different from said one interconnection layer, on which a power supply line is provided;

at least one power supply line disposed on said one interconnection layer at an area corresponding to the area at which said capacitor cell is placed, said power supply line being electrically connected to corresponding said power supply line on said other interconnection layer through at least one connecting via; and

a cell disposed in the vicinity of said capacitor cell having a circuit including at least one active element;

wherein said capacitor cell constitutes a decoupling capacitor of said cell disposed in the vicinity of said capacitor cell;

wherein said power supply line provided on said one interconnection layer at an area corresponding to the area where said capacitor cell is disposed constitutes a power supply path to said cell;

wherein said cell comprises at least one higher voltage power supply terminal and at least one lower voltage power supply terminal on both side of a row on which said cell is disposed;

wherein said semiconductor device has said capacitor cell on at least one of two columns sandwiching said cell there between on the same row as that on which said cell is disposed; and

wherein power is supplied to said higher and/or lower voltage power supply terminal of said cell through said power supply line provided on said one interconnection layer over said capacitor cell disposed area and is connected to higher and/or lower voltage power supply line of said other interconnection layer.

Assignments (2)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0842 →