Nonvolatile memory semiconductor device and method for manufacturing same

1. A nonvolatile memory semiconductor device, comprising:

a semiconductor substrate;

a floating gate provided on said semiconductor substrate;

a control gate provided on said semiconductor substrate; and

a tunnel insulating film, composed of a silicon oxide film and disposed adjacent to said floating gate,

wherein concentration of atomic nitrogen in said tunnel insulating film is 0.1 to 5 atomic %,

and wherein concentration of atomic nitrogen in an interface layer of said tunnel insulating film is 10 times or more higher than concentration of atomic nitrogen in other portion of said tunnel insulating film except said interface layer, said interface layer extending from a surface of said tunnel insulating film in a side of said floating gate to a vicinity of said surface.

2. The nonvolatile memory semiconductor device according to claim 1 , wherein said tunnel insulating film is disposed between said floating gate and said control gate.

3. The nonvolatile memory semiconductor device according to claim 1 , wherein said tunnel insulating film is provided on said semiconductor substrate, and said floating gate is provided on said tunnel insulating film.

4. The nonvolatile memory semiconductor device according to claim 1 , wherein density per unit area of atomic nitrogen in the surface of said tunnel insulating film in the side of said floating gate is equal to or lower than 4×1014 atoms/cm 2 .

5. The nonvolatile memory semiconductor device according to claim 1 , wherein nitrogen (N) atoms in four types of binding conditions exist on said interface layer of said tunnel insulating film,

said four types of binding conditions including:

first binding condition, in which all of first proximal atom directly bonded to nitrogen atom are silicon (Si) atoms, and second proximal atom bonded to Si atom are N atom or Si atom;

second binding condition, in which all of first proximal atom directly bonded to nitrogen atom are silicon (Si) atom, and second proximal atom bonded to Si atoms include one or more oxygen atom;

third binding condition, in which two of first proximal atom directly bonded to nitrogen atom are silicon (Si) atom, and one thereof is oxygen (O) atom; and

fourth binding condition, in which one of first proximal atom directly bonded to nitrogen atom are silicon (Si) atom, and two thereof are oxygen (O) atom,

wherein substantially no nitrogen atom in fifth binding condition, in which all of first proximal atom directly bonded to nitrogen atom are oxygen (O) atom, exists on said interface layer.

6. The nonvolatile memory semiconductor device according to claim 5 , wherein concentration of nitrogen atom in second binding condition in said interface layer is equal to or higher than twice of concentration of nitrogen atom in first binding condition.

7. The nonvolatile memory semiconductor device according to claim 5 , wherein substantially no nitrogen atom in fifth binding condition exist in said tunnel insulating film.

8. The nonvolatile memory semiconductor device according to claim 1 , wherein said interface layer comprises a nitrided region of said tunnel insulating film extending from a boundary of said tunnel insulating film with said floating gate and having a thickness of about 3 nm.

9. A method for manufacturing a nonvolatile memory semiconductor device, said nonvolatile memory semiconductor device comprising: a semiconductor substrate; a floating gate provided on said semiconductor substrate; a control gate; a tunnel insulating film, disposed adjacent to said floating gate and composed of a silicon oxide film,

wherein concentration of atomic nitrogen in said tunnel insulating film is 0.1 to 5 atomic %,

and wherein said method further comprises forming said tunnel insulating film to have concentration of atomic nitrogen in an interface layer of said tunnel insulating film that is 10 times or more higher than concentration of atomic nitrogen in other portion of said tunnel insulating film except said interface layer, said interface layer extending from a surface of said tunnel insulating film in a side of said floating gate to a vicinity of said surface.

10. The method for manufacturing a nonvolatile memory semiconductor device according to claim 9 ,

wherein said method comprises:

forming said floating gate on said semiconductor substrate;

said forming said tunnel insulating film; and

forming said control gate on said tunnel insulating film, and

wherein, in said forming said tunnel insulating film, a silicon oxide film is formed on said floating gate via a chemical vapor deposition (CVD) process, and then, said silicon oxide film is heat-treated within N 2 O gas at a temperature of equal to or higher than 950 degree C. to form said tunnel insulating film.

11. The method for manufacturing a nonvolatile memory semiconductor device according to claim 9 , wherein said method comprises:

said forming the tunnel insulating film;

forming said floating gate on said tunnel insulating film; and

forming said control gate on said floating gate,

wherein, in said forming the tunnel insulating film, a silicon oxide film is formed on said semiconductor substrate gate via a chemical vapor deposition (CVD) process, and then, said silicon oxide film is exposed to a plasma within a gas containing nitrogen to form said tunnel insulating film.

12. The method for manufacturing a nonvolatile memory semiconductor device according to claim 9 , wherein said forming said tunnel insulating film further comprises forming a silicon oxide film on said floating gate and heat-treating said silicon oxide film with N 2 O gas to form said interface layer comprising a region of said tunnel insulating film extending from a boundary between said tunnel insulating film and said floating gate and having a thickness of about 3 nm.