Patent Assignment
Reel/Frame 017976/0218
Assignment of Assignor's Interest
Recorded: 2006-06-06
Pages: 2
Assignor
MATSUDA, SHUICHI
Executed: 2006-03-25
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Resin-Sealed Area on Circuit Board Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 6, 2006
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017976/0648 →
Change of Name
Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0842 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →