Semiconductor memory device having reference transistor and method of manufacturing the same

1. A semiconductor memory device, comprising:

a substrate;

a memory cell transistor of a split-gate type formed on said substrate, said memory cell transistor having a source/drain region, a floating gate and a control gate, and is configured to store data and generate a read current;

a MIS (Metal Insulator Semiconductor) reference transistor formed on said substrate, said reference transistor having a source/drain region and a first single gate and is configured to generate a reference current;

a sense amplifier connected to said source/drain region of said memory cell transistor and to said source/drain region of said reference transistor, said sense amplifier being configured to compare said read current generated by said memory cell transistor with said reference current generated by said reference transistor to read said data stored in said memory cell transistor;

a conductive layer formed above said reference transistor;

a MIS (Metal Insulator Semiconductor) logic transistor used in a logic circuit, said logic transistor having a second single gate whose material and thickness are the same as those of said conductive layer;

a first insulating film formed between said first single gate and said substrate;

a second insulating film formed between said conductive layer and said first single gate;

a third insulating film formed between said second single gate and said substrate; and

a contact configured to penetrate through said second insulating film, and connected to said first single gate,

wherein said first single gate operates as a gate electrode of said reference transistor.

2. The semiconductor memory device according to claim 1 , wherein a material of said control gate is the same as that of said first single gate.

3. A semiconductor memory device, comprising:

a substrate;

a memory cell transistor of a split-gate type formed on said substrate, wherein said memory cell transistor comprises a source/drain region, a floating gate, a control gate and a first gate insulating film located between said substrate and said control gate;

a reference transistor formed on said substrate and used for generating a reference current that is used in sensing data stored in said memory cell transistor, wherein said reference transistor comprises a source/drain region, a first single gate and a second gate insulating film located between said substrate and said first single gate;

a sense amplifier coupled to said memory cell transistor and said reference transistor, wherein said sense amplifier is connected to said source/drain regions of both of said memory cell transistor and said reference transistor, and compares a read current generated by said memory cell transistor with said reference current generated by said reference transistor to read said data stored in said memory cell transistor;

a conductive layer formed above said reference transistor;

a logic transistor used in a logic circuit, wherein said logic transistor comprises a second single gate and a third gate insulating film located between said substrate and said second single gate;

a fourth insulating film formed between said first single gate and said conductive layer; and

a contact configured to penetrate through said fourth insulating film, and connected to said first single gate;

said first single gate operates as a gate electrode of said reference transistor;

a material of said control gate is the same as that of said first single gate; and

a material and a thickness of said second single gate are the same as those of said conductive layer.

4. The semiconductor memory device according to claim 1 , wherein:

an impurity concentration distribution in said source/drain region of said reference transistor is equal to that of said memory cell transistor;

said first insulating film is further formed between said substrate and said control gate; and

said memory cell transistor is formed on a first well in said substrate, said reference transistor is formed on a second well in said substrate, and an impurity concentration distribution in said second well is equal to that in said first well.

5. The semiconductor memory device according to claim 1 , wherein:

said memory cell transistor has a stacked gate structure in which said floating gate and said control gate partially overlap with each other;

said memory cell transistor further has a contact connected to said source-drain region;

said floating gate is fonned between said contact and said control gate; and

said floating gate has a pointed tip section overlapping with said control gate and pointing from said floating gate toward said control gate.

6. The semiconductor memory device according to claim 3 , wherein:

an impurity concentration distribution in said source/drain region of said reference transistor is equal to that of said memory cell transistor;

a material and a thickness of said second gate insulating film are the same as those of said first gate insulating film; and

said memory cell transistor is formed on a first well in said substrate, said reference transistor is formed on a second well in said substrate, and an impurity concentration distribution in said second well is equal to that in said first well.

7. The semiconductor memory device according to claim 3 , wherein:

said memory cell transistor has a stacked gate structure in which said floating gate and said control gate partially overlap with each other;

said memory cell transistor further has a contact connected to said source-drain region;

said floating gate is formed between said contact and said control gate; and

said floating gate has a pointed tip section overlapping with said control gate and pointing from said floating gate toward said control gate.

8. The semiconductor memory device according to claim 1 , further comprising: a fourth insulating film formed between said control gate and said substrate,

wherein a thickness of said first insulating film is the same as that of said fourth insulating film.

9. The semiconductor memory device according to claim 3 ,

wherein a thickness of said first gate insulating film is the same as that of said second gate insulating film.

10. A semiconductor device comprising:

a substrate which includes a first, a second and a third regions;

a memory cell transistor formed in said first region;

a reference transistor formed in said second region;

a logic transistor formed in said third region and used in a logic circuit; and

a sense amplifier coupled to said memory cell transistor and said reference transistor, and configured to compare a read current generated by said memory cell transistor with a reference current generated by said reference transistor to read data stored in said memory cell transistor,

wherein said memory cell transistor comprises:

a first insulating layer formed above said substrate;

a charge storage layer formed above said first insulating layer;

a second insulating layer formed above said charge storage layer;

a first conductive layer formed at a side of said charge storage layer and said second insulating layer as a side wall, and operating as a control gate electrode of said memory cell transistor;

a third insulating layer formed between said substrate and said first conductive layer; and

a first and a second diffusion layers formed on a surface of said substrate corresponding to a position such that said charge storage layer and said first conductive layer are between said first and second diffusion layers, and operating as a source and a drain of said memory cell transistor,

wherein said reference transistor comprises:

a fourth insulating layer formed above said substrate, having a same thickness as said third insulating layer, and composed of a same material as said third insulating layer;

a second conductive layer formed above said fourth insulating layer, composed of a same material as said first conductive layer, and operating as a gate electrode of said reference transistor;

a fifth insulating layer formed above said second conductive layer;

a third conductive layer formed above said fifth insulating layer;

a contact configured to penetrate through said fifth insulating layer, and coupled to said second conductive layer; and

a third and a fourth diffusion layers formed on a surface of said substrate corresponding to a position such that said second conductive layer is between said third and fourth diffusion layers, and operating as a source and a drain of said reference transistor, and

wherein said logic transistor comprises:

a sixth insulating layer formed above said substrate;

a fourth conductive layer formed above said sixth insulating layer, having a same thickness as said third conductive layer, composed of a same material as said third conductive layer, and operating as a gate electrode of said logic transistor; and

a fifth and a sixth diffusion layers formed on a surface of said substrate corresponding to a position such that said fourth conductive layer is between said fifth and sixth diffusion layers, and operating as a source and a drain of said logic transistor.

11. The semiconductor device according to claim 10 ,

wherein said memory cell transistor has a stacked structure in which said charge storage layer and said first conductive layer partially overlap with each other, and

wherein said charge storage layer has a pointed tip section overlapping with said first conductive layer, and pointing from said charge storage layer toward said first conductive layer.