Patent Assignment
Reel/Frame 025346/0840
Change of Name
Recorded: 2010-11-11
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Resin Molded Semiconductor Device
Data Transfer Apparatus for Low Voltage Differential Signaling
Display Control Circuit
Chemically Amplified Resist Composition and Manufacturing Method of Semiconductor Integrated Circuit Device with Such Chemically Amplified Resist Composition
Current Source Circuit and Method of Outputting Current
Semiconductor Device Memory Cell
Charge Pump Circuit Capable of Completely Cutting Off Parasitic Transistors
Semiconductor Device and Method of Manufacturing Thereof
Memory Device, Display Control Driver with the Same, and Display Apparatus Using Display Control Driver
Power Supply Control Apparatus Including Highly-Reliable Overcurrent Detecting Circuit
Scan Electrode Driving Circuit and Display Apparatus
Method of Manufacturing a Semiconductor Device
Semiconductor Memory Device
Method of Manufacturing a Semiconductor Capacitive Element in a Semiconductor Device
Differential Amplifier, Data Driver and Display Device
Chemical Mechanical Polishing Apparatus and Method of Chemical Mechanical Polishing
Data Recording Device, Data Recording Method, and Recording Control Program
Photocurrent-To-Voltage Conversion Apparatus Including Non-Diode-Connected Clamping Mos Transistor
Semiconductor Device
Manufacturing Method of Semiconductor Device
Semiconductor Device Having a Memory Cell Section, an Adjacent Circuit Section, and Silicide Formed on an Impurity Diffused Region
Semiconductor Memory
Display Driving Circuit and Display Device Using the Same
Semiconductor Device and Its Manufacturing Method
Leadless Type Semiconductor Package, and Production Process for Manufacturing Such Leadless Type Semiconductor Package
Flip-Chip Type Semiconductor Device, Production Process for Manufacturing Such Flip-Chip Type Semiconductor Device, and Production Process for Manufacturing Electronic Product Using Such Flip-Chip Type Semiconductor Device
Semiconductor Device Having Plural Electroconductive Plugs
Semiconductor Memory Device
Phase-Shifting Mask and Method of Forming Pattern Using the Same
Photoelectric Current and Voltage Converting Circuit
Photoelectric Current and Voltage Converting Circuit
Lateral Planar Type Power Semiconductor Device Including Drain Buried Region Immediately Below Drain Region and Its Manufacturing Method
Data Processing System for Debugging Utilizing Halts in a Parallel Device
Method of Delay Calculation in Integrated Circuit, and Timing Analysis System Using the Same
Two-Bit Cell Semiconductor Memory Device
Method of manufacturing non-volatile semiconductor memory device and method for controlling same
Lead Frame, Semiconductor Device Using the Same and Method of Producing the Semiconductor Device
Electronic Component and Method of Manufacturing the Same
Semiconductor Device and Method of Forming the Same as Well as a Photo-Mask Used Therein
Resist Pattern Defined by Inwardly Arched Lines
Differential Amplifier Circuit and Drive Circuit of Liquid Crystal Display Unit Using the Same
Semiconductor Device and Method of Manufacturing the Same
Data read/write control system and data read/write control method
Application:
10/942,023 →
Publication:
US 2005/0066112
Semiconductor Device Capable of Suppressing Variation of Current or Voltage to Be Supplied to External Circuit
Driver Circuit
Semiconductor Device Including a Semiconductor Chip Mounted on a Metal Base
Overvoltage Protection Circuit of Output Mos Transistor
Differential Ab Class Amplifier Circuit and Drive Circuit Using the Same
Output Circuit
Analog Signal Outputting Circuit and Multi-Level Delta-Sigma Modulator Employing the Analog Signal Outputting Circuit
Oscillator Circuit and Integrated Circuit Incorporating the Same
Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having Silicon on Insulator Structure and Method of Fabricating the Same
Controller/Driver for Driving Display Panel
Data Driver Circuit for Display Device and Drive Method Thereof
Controller/Driver for Driving Display Panel
Double-Diffused Semiconductor Device
Semiconductor Integrated Circuit
Integrated Circuit
Pll Circuit with Simulation Components to Reduce Phase Offset
Circuit Board
Semiconductor Device Having Mim Structure Resistor
Semiconductor Logic Circuit Device Having Pull-Up/Pull-Down Circuit for Input Buffer Pad and Wafer-Probing Testing Method Therefor
Output Circuit
Band-Gap Type Constant Voltage Generating Circuit
I/O Interface Circuit of Integrated Circuit
Semiconductor Device and Method of Manufacturing the Same
Output Circuit, Digital Analog Circuit and Display Device
Integrated Circuit Design Method and System
Scan Test Method, Integrated Circuit, and Scan Test Circuit
Canceller Circuit and Controlling Method
Semiconductor Device and a Method for the Manufacture Thereof
Differential Amplifying Circuit
Semiconductor Device and Semiconductor Integrated Circuit Device
Semiconductor Device
Differential Amplifier
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device with Multi-Layered Wiring Arrangement Including Reinforcing Patterns, and Production Method for Manufacturing Such Semiconductor Device
Semiconductor Device for Driving Current Load Device, and Display Device
Common Inversion Driving Type Liquid Crystal Display Device and Its Driving Method Capable of Suppressing Color Errors
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Memory Device and Control Method Thereof
Image Processing Alignment Method and Method of Manufacturing Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device Having an Interconnect That Increases in Impurity Concentration as Width Increases
Semiconductor Testing Device
Offset-Bonded, Multi-Chip Semiconductor Device
Semiconductor Memory Device with Plural Source/Drain Regions
Semiconductor Integrated Circuit Device Capacitive Node Interconnect
Vertical-Type Metal Insulator Semiconductor Field Effect Transistor Device, and Production Method for Manufacturing Such Transistor Device
Method of Fabricating Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 22, 2004
From: NISHIZAKA, TEIICHIROU; KANAMORI, KOHJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 015914/0917 →
Assignment of Assignor's Interest
Jun 6, 2007
From: KOIKE, MASAHIRO; NARITA, HIROCHIKA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019426/0503 →
Assignment of Assignor's Interest
Jun 11, 2010
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024524/0249 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →