Lead frame, semiconductor device using the same and method of producing the semiconductor device
View Patent ↗A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board.
1. A method of producing a semiconductor device for causing a surface of a lead frame to partly appear on a bottom of said semiconductor device, said method comprising the steps of:
forming a lead frame having a base portion with a substantially flat bottom;
forming an island portion and an electrode portion on top of said base portion;
mounting a semiconductor chip to said island portion;
connecting electrodes formed on a surface of said semiconductor chip and said electrode portion with bonding wires;
sealing part of a top and part of a bottom of said lead frame, which include said island portion, base said semiconductor chip, said electrode portion and said bonding wire, with seal resin;
grinding an entire surface of said seal resin beneath said lead frame in parallel to the bottom of said lead frame; and
causing part of the bottom of said base to appear on a bottom of said seal resin.
2. The method as claimed in claim 1 , wherein said lead frame comprises:
a pair of base portions each having a substantially flat bottom;
a pair of electrode portions each being at least partly integrally formed with a top of one of said pair of base portions; and
said island portion at least partly integrally formed with tops of said pair of base portions, connecting said tops to each other.
3. A method of producing a semiconductor device for causing a surface of a lead frame to partly appear on a bottom of said semiconductor device, said method comprising the steps of:
mounting a semiconductor chip to an island portion included in said lead frame;
connecting electrodes formed on a surface of said semiconductor chip and an electrode portion with bonding wires;
sealing part of a top and part of a bottom of said lead frame, which include said island portion, said semiconductor chip, said electrode portion and said bonding wire, with seal resin;
grinding an entire surface of said seal resin beneath said lead frame in parallel to the bottom of said lead frame;
causing part of the bottom of said lead frame to appear on a bottom of said seal resin;
half-cut dicing a bottom of said island portion;
plating the bottom of said lead frame and the bottom of said island portion appeared on a bottom of said semiconductor device; and
cutting a connecting portion, which forms part of a base portion of said lead frame, by half-cut dicing.
4. The method as claimed in claim 3 , wherein said lead frame comprises:
said base portion having a substantially flat bottom, and
said island portion and said electrode portion partly formed integrally with a top of said base portion.
5. The method as claimed in claim 3 , wherein said lead frame comprises:
a pair of base portions each having a substantially flat bottom;
a pair of electrode portions each being at least partly integrally formed with a top of one of said pair of base portions; and
said island portion at least partly integrally formed with tops of said pair of base portions, connecting said tops to each other.