Patent Assignment
Reel/Frame 019426/0503
Assignment of Assignor's Interest
Recorded: 2007-06-06
Pages: 3
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Resin Molded Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.