IP Library Granted Patent US 7,118,835
Granted Patent B2
US 7,118,835 · App. 10/938,504 · Granted Oct 10, 2006

Semiconductor device and method of forming the same as well as a photo-mask used therein

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Quick Facts
Patent No.
US 7,118,835
App. No.
10/938,504
Granted
Oct 10, 2006
Kind
B2
Abstract

A method of forming a device pattern of a semiconductor device. The method includes the steps of carrying out an over-exposure to a resist film using a mask which has transmission regions which are positioned about a circumference of each of intended patterns of a resist film. Then carrying out a development of the resist film to form a resist pattern having the intended patterns. And then forming a device pattern of a semiconductor device by use of the resist pattern.

Claims (3)

1. A mask to be used for an exposure in a lithography process, said mask having inverted patterns comprising transmission regions which are positioned on a circumference of each of intended patterns of a resist film.

2. The mask as claimed in claim 1 , wherein said inverted patterns comprise rectangle-shaped patterns which are so arranged that six of said rectangle-shaped pattern surround an opaque area which corresponds in position to each of said intended patterns of said resist film.

3. The mask as claimed in claim 2 , wherein each of capacitive contact patterns is positioned at a center of said opaque area surrounded by six of said rectangle-shaped patterns.

Assignments (1)
CHANGE OF NAME Recorded Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0840 →