Semiconductor device
View Patent ↗A heterojunction bipolar transistor, having a structure in which a subcollector layer of a first conductive type having a higher doping concentration than a collector layer, a collector layer of the first conductive type, a base layer of the second conductive type, and an emitter layer of the first conductive type are deposited, in order, on a semi-insulating semiconductor substrate, and in which a hole barrier layer of semiconductor material with a band gap wider than that of the base layer is inserted between the base layer and the collector layer, so as to be in direct contact with the base layer.
1. A heterojunction bipolar transistor comprising:
a first conductive type collector layer;
a first conductive type subcollector layer with a doping concentration higher than the collector layer;
a second conductive type base layer;
a first conductive type emitter layer, wherein the first conductive type subcollector layer, the second conductive type base layer, and the first conductive type emitter layer are formed, in order, on a semi-insulating semiconductor substrate; and
a hole barrier layer of semiconductor material with a band gap wider than that of the second conductive type base layer is disposed between the second conductive type base layer and the first conductive type collector layer, such that the hole barrier layer is in direct contact with the second conductive type base layer,
wherein a thickness of said hole barrier layer is 4 nm or greater, and less than 10 nm.
2. The heterojunction bipolar transistor according to claim 1 , wherein the interface between the hole barrier layer and the base layer is delta-doped with an impurity of the second conductive type.
3. The heterojunction bipolar transistor according to claim 1 , wherein the base layer comprises, on the side in contact with the hole barrier layer, a semiconductor layer, the concentration of the second conductive type impurity of which is higher than in other regions within the base layer.
4. The heterojunction bipolar transistor according to claim 1 , wherein the hole barrier layer is the first conductive type or a non-doped layer.
5. The heterojunction bipolar transistor according to claim 1 , wherein a first semiconductor layer, with a band gap wider than the collector layer, is located between the collector layer and the subcollector layer.
6. The heterojunction bipolar transistor according to claim 1 , wherein the hole barrier layer comprises an InGaP layer, including a natural superlattice formed in the InGaP layer.
7. A heterojunction bipolar transistor comprising:
a first conductive type collector layer;
a first conductive type subcollector layer with a doping concentration higher than the collector layer;
a second conductive type base layer;
a first conductive type emitter layer, wherein the first conductive type subcollector layer, the second conductive type base layer, and the first conductive type emitter layer are formed, in order, on a semi-insulating semiconductor substrate; and
a hole barrier layer of semiconductor material with a band gap wider than that of the second conductive type base layer is disposed between the second conductive type base layer and the first conductive type collector layer, such that the hole barrier layer is in direct contact with the second conductive type base layer,
wherein a semiconductor layer, with a band gap wider than the collector layer, is located between the collector layer and the subcollector layer, and the semiconductor layer comprises an InGaP layer, including a natural superlattice formed in the InGaP layer.
8. The heterojunction bipolar transistor according to claim 5 , wherein a second semiconductor layer, including an impurity concentration higher than that of the first semiconductor layer, is located between the first semiconductor layer and the collector layer.
9. The heterojunction bipolar transistor according to claim 8 , wherein the second semiconductor layer comprises one of GaAs and InGaP.
10. The heterojunction bipolar transistor according to claim 5 , wherein the interface between the first semiconductor layer and the collector layer is delta-doped with an impurity of the first conductive type.
11. The heterojunction bipolar transistor according to claim 1 , wherein the hole barrier layer comprises a doping concentration of 2×10 18 cm −3 , and an ordering-system In 0.48 Ga 0.52 P with a band gap of 1.85 eV.
12. The heterojunction bipolar transistor according to claim 1 , wherein the first conductive type collector layer comprises 800 nm thick GaAs doped to 5×10 15 cm −3 .
13. The heterojunction bipolar transistor according to claim 1 , wherein the second conductive base layer comprises 80 nm thick GaAs doped to 4×10 19 cm −3 .
14. The heterojunction bipolar transistor according to claim 1 , wherein the first conductive emitter layer comprises 30 nm thick In 0.48 Ga 0.52 P doped to 3×10 17 cm −3 .
15. The heterojunction bipolar transistor according to claim 1 , wherein the first conductive type subcollector layer comprises GaAs doped to 4×10 18 cm −3 .
16. The heterojunction bipolar transistor according to claim 1 , wherein an offset voltage is less than 30 mV when the thickness of the hole barrier layer comprises 5 nm or greater, and less than 10 nm.
17. The heterojunction bipolar transistor according to claim 1 , wherein a turn-on resistance is less than 65×10 −7 Ω-cm 2 when a thickness of the hole barrier layer is approximately 5 nm.
18. The heterojunction bipolar transistor according to claim 1 , wherein the band gap of the emitter layer is wider than the band gap of the base layer.
19. A heterojunction bipolar transistor comprising:
a first conductive type collector layer;
a first conductive type subcollector layer with a doping concentration higher than the collector layer;
a second conductive type base layer;
a first conductive type emitter layer, wherein the first conductive type subcollector layer, the second conductive type base layer, and the first conductive type emitter layer are formed, in order, on a semi-insulating semiconductor substrate; and
a hole barrier layer of semiconductor material with a band gap wider than that of the second conductive type base layer is disposed between the second conductive type base layer and the first conductive type collector layer, such that the hole barrier layer is in direct contact with the second conductive type base layer;
a first semiconductor layer, with a band gap wider than the collector layer, is located between the collector layer and the subcollector layer; and
a second semiconductor layer, including an impurity concentration higher than that of the first semiconductor layer, is located between the first semiconductor layer and the collector layer.
20. A heterojunction bipolar transistor comprising:
a first conductive type collector layer;
a first conductive type subcollector layer with a doping concentration higher than the collector layer;
a second conductive type base layer;
a first conductive type emitter layer, wherein the first conductive type subcollector layer, the second conductive type base layer, and the first conductive type emitter layer are formed, in order, on a semi-insulating semiconductor substrate; and
a hole barrier layer of semiconductor material with a band gap wider than that of the second conductive type base layer is disposed between the second conductive type base layer and the first conductive type collector layer, such that the hole barrier layer is in direct contact with the second conductive type base layer;
a first semiconductor layer, with a band gap wider than the collector layer, is located between the collector layer and the subcollector layer; and
a second semiconductor layer, comprised of one of GaAs and InGaP, is located between the first semiconductor layer and the collector layer.