Patent Assignment
Reel/Frame 014243/0295
Assignment of Assignor's Interest
Recorded: 2003-06-25
Pages: 3
Assignors
PARK, HONG-SICK
Executed: 2003-06-25
KANG, SUNG-CHUL
Executed: 2003-06-25
CHO, HONG-JE
Executed: 2003-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Etchant for Wire, Method of Manufacturing Wire Using Etchant, Thin Film Transistor Array Panel Including Wire and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.