Patent Assignment
Reel/Frame 014246/0936
Assignment of Assignor's Interest
Recorded: 2003-06-30
Pages: 3
Assignors
LEONG, KUM FOO
Executed: 2003-06-30
TAI, SIEW FONG
Executed: 2003-06-30
CHUNG, CHEE KEY
Executed: 2003-06-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Solder Interface Locking Using Unidirectional Growth of an Intermetallic Compound
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.