Patent Assignment
Reel/Frame 014247/0079
Assignment of Assignor's Interest
Recorded: 2003-06-26
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Multi-Layer Polymer-Solder Hybrid Thermal Interface Material for Integrated Heat Spreader and Method of Making Same