Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
A process of making a multi-layer thermal interface material is depicted. The multi-layer thermal interface material is attached between an integrated heat spreader and a die. Processing of the multi-layer thermal interface material includes stamping or other pressure processing.
1. An article comprising:
a plurality of first heat transfer structures disposed in a matrix of a second heat transfer structure;
a solder preform disposed on the matrix; and
a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient.
2. The article according to claim 1 , wherein the matrix is a polymer, and wherein the plurality of first heat transfer structures is selected from graphite, diamond powder, inorganic dielectric particles, and metal particles.
3. The article according to claim 1 , further including:
a middle heat transfer structure disposed between the matrix and the solder preform, wherein the middle heat transfer structure includes a composition that is transitional between the composition of the matrix and the composition of the solder preform.
4. The article according to claim 1 , further including:
a middle heat transfer structure disposed between the matrix and the solder preform, wherein the middle heat transfer structure includes a composition that is transitional between the composition of the matrix and the composition of the solder preform, wherein the transition between the matrix and the solder preform includes a first interface between the solder preform and the middle heat transfer structure and a second interface between the middle heat transfer structure and the matrix.
5. The article according to claim 1 , further including:
at least one particulate material in the matrix in addition to the plurality of first heat transfer structures.
6. The article according to claim 1 , wherein the plurality of first heat transfer structures includes a concentration region in a portion of the matrix.
7. A package comprising:
a heat spreader;
a die disposed below the heat spreader; and
a heat transfer composite disposed above and on the die and below and on the heat spreader, wherein the heat transfer composite includes:
a plurality of first heat transfer structures disposed in a matrix of a second heat transfer structure, wherein the matrix is a polymer, and wherein the matrix is disposed on the die; and
a solder preform disposed on the matrix, wherein the solder preform is disposed on the heat spreader.
8. The package according to claim 7 , wherein the heat spreader includes a cladding layer selected from nickel, nickel-copper, and gold.
9. The package according to claim 7 , wherein the die includes a cladding layer selected from nickel, nickel-copper, and gold.
10. The package according to claim 7 , wherein the die includes an active surface and a backside surface, the package further including:
a mounting substrate, and wherein the die is electrically coupled at the active surface to the mounting substrate.
11. The article of claim 1 , wherein the transition is an interface, and wherein the transition includes a solder-rich zone overlapping a polymer-rich zone.
12. The article of claim 1 , wherein the transition is a concentration gradient between a solder-rich zone and a polymer-rich zone.
13. The article of claim 3 , wherein the transition is an interface, and wherein the transition includes a solder-rich zone overlapping a polymer-rich zone.
14. The article of claim 3 , wherein the transition is a concentration gradient between a solder-rich zone and a polymer-rich zone.
15. The article of claim 1 , further including a lower tie layer, selected from an organic adhesive and a metal.
16. The article of claim 1 , further including an upper tie layer, selected from an organic adhesive and a metal.
17. The article of claim 1 , further including at least one of:
a lower tie layer disposed above and on the matrix, selected from an organic adhesive and
a metal; and
an upper tie layer disposed below and on the solder preform, selected from an organic adhesive and a metal.
18. The package of claim 7 , further including:
a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient.
19. The article of claim 18 , wherein the transition is selected from an interface and a concentration gradient, and wherein the transition includes a solder-rich zone overlapping a polymer-rich zone.
20. The package of claim 7 , further including:
a middle heat transfer structure disposed between the matrix and the solder preform, wherein the middle heat transfer structure includes a composition that is transitional between the composition of the matrix and the composition of the solder perform; and
a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient, and wherein the transition is a gradient between a solder-rich zone and a polymer-rich zone.
21. The package of claim 20 further including at least one of:
a lower tie layer disposed above an on the matrix, wherein the lower tie layer is selected from an organic adhesive and a metal; and
an upper tie layer disposed above and on the middle heat transfer structure wherein the upper tie layer is selected from an organic adhesive and a metal.
22. An article comprising:
a plurality of first heat transfer structures disposed in a matrix of a second heat transfer structure;
a solder preform disposed on the matrix; and
a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient, wherein the transition is selected from an interface and a gradient, and wherein the transition includes a solder-rich zone overlapping a polymer-rich zone.
23. The article of claim 22 , further including:
a middle heat transfer structure disposed between the matrix and the solder preform, wherein the middle heat transfer structure includes a composition that is transitional between the composition of the matrix and the composition of the solder perform; and
a transition between the matrix and the solder preform, wherein the transition is selected from an interface and a concentration gradient, and wherein the transition is a gradient between a solder-rich zone and a polymer-rich zone.
24. The article of claim 22 , further including at least one of:
a lower tie layer disposed above and on the matrix, selected from an organic adhesive and a metal; and
an upper tie layer disposed below and on the solder preform, selected from an organic adhesive and a metal.