Patent Assignment
Reel/Frame 014253/0333
Assignment of Assignor's Interest
Recorded: 2004-01-12
Pages: 6
Assignors
HECK, JOHN
Executed: 2003-11-03
HAYDEN, JOSEPH S. III
Executed: 2003-11-30
GREATHOUSE, STEVE W.
Executed: 2003-11-30
WONG, DANIEL M.
Executed: 2003-11-30
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Mems Packaging Using a Non-Silicon Substrate for Encapsulation and Interconnection