Patent Assignment
Reel/Frame 014254/0827
Assignment of Assignor's Interest
Recorded: 2003-07-11
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE KAOSHIUNG, KAOSHIUNG, R.O.C., TAIWAN
Covered Property
(1)
Wafer Level Package Structure with a Heat Slug