Security Interest

Recorded: 2003-07-14 Received: 2003-07-16 Pages: 8

Assignor

Executed: 2003-04-22

Assignee

1633 BROADWAY, 25TH FLOOR, NEW YORK, NY, 10019, UNITED STATES

Covered Properties (10)

Epoxy Resin Curing Compositions and Resin Compositions Including Same

Application: 10/351,903 →

Epoxy resin compositions, methods of preparing, and articles made therefrom

Application: 10/349,673 →

Glycidyl Ester of Cooh Polyester and Curing Agent

Application: 10/219,681 →

Modified Epoxy Resin Composition, Production Process for the Same and Solvent-Free Coating Comprising the Same

Application: 10/145,829 →

Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

Application: 10/091,262 →

Attachment of Surface Mount Devices to Printed Circuit Boards Using a Thermoplastic Adhesive

Application: 10/091,086 →

Arrangement for the Cooling of the Casing of an Aircraft Gas Turbine Engine

Application: 09/942,934 →

Isocyanate-Modified Epoxy-Functional Polyester

Application: 09/839,312 →

Catalyst Promotor for the Manufacture of Polyphenols

Application: 09/834,460 →

Composition of Epoxy Resin and Triazine-Formaldehyde-Phenol Resin

Application: 09/784,624 →