IP Library Granted Patent US 7,001,938
Granted Patent B2
US 7,001,938 · App. 10/351,903 · Granted Feb 21, 2006

Epoxy resin curing compositions and resin compositions including same

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Quick Facts
Patent No.
US 7,001,938
App. No.
10/351,903
Granted
Feb 21, 2006
Kind
B2
Abstract

Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.

Claims (23)

1. A curing composition for an epoxy resin composition comprising a primary amino alcohol physically blended, without the formation of a reaction product, with a curing agent wherein the primary amino alcohol is represented by the formula:

wherein each of R1 and R2 is independently selected from the group consisting of R′O—, R′OO— and HO—CH 2 — where each R′ is hydrogen or a hydrocarbyl group containing 1 to 20 carbon.

2. The curing composition of claim 1 wherein the primary amino alcohol is tris(hydroxymethyl)aminomethane.

3. The curing composition of claim 1 wherein the curing agent is an amine- and/or amide-containing curing agents.

4. The curing composition of claim 3 wherein the primary amino alcohol is present in a range from between about 1 to about 50% by weight of the curing agent.

5. The curing composition of claim 1 wherein the curing agent is a latent curing agent and the epoxy resin composition is a powder coating composition.

6. The curing composition of claim 5 wherein the curing agent is selected from the group consisting of aromatic amines, melamines, substituted melamines, imidazoles, substituted imidazoles, and combinations there of.

7. The curing composition of claim 1 wherein the curing agent is dicyandiamide.

8. The curing composition of claim 1 wherein the curing agent is phenolic compound or a resinous phenolic compound.

9. The curing composition of claim 8 wherein the curing agent is selected from the group consisting of dihydroxy phenols, biphenols, bisphenols, halogenated biphenols, halogenated bisphenols, hydrogenated bisphenols, alkylated biphenols, alkylated bisphenols, trisphenols, phenol-aldehyde resins, phenol-aldehyde novolac resins, halogenated phenol-aldehyde novolac resins, substituted phenol-aldehyde novolac resins, phenol-hydrocarbon resins, substituted phenol-hydrocarbon resins, phenol-hydroxydroxybenzaldehyde resins, alkylated phenol-hydroxybenzaldehyde resins, hydrocarbon-phenol resins, hydrocarbon-halogenated phenol resins, hydrocarbon-alkylated phenol resins, and combinations thereof.

10. The curing composition of claim 8 wherein the curing agent is selected from the group consisting of substituted or unsubstituted phenols, substituted or unsubstituted biphenols, substituted or unsubstituted bisphenols, substituted or unsubstituted novolacs, and combinations thereof.

11. The curing composition of claim 8 wherein the curing agent is a resinous phenolic compound with a phenolic hydroxyl equivalent weight in the range of 200 to 1000.

12. The curing composition of claim 8 wherein the primary amino alcohol is present in a range from between about 0.1 to about 25% by weight of the curing agent.

13. An epoxy resin composition comprising the curing composition of claim 1 .

14. The epoxy resin composition of claim 13 wherein the primary amino alcohol is tris(hydroxymethyl)aminomethane.

15. A method for curing an epoxy resin composition comprising contacting the epoxy resin composition wit a curing agent comprising a primary amino alcohol reacted into a resinous phenolic compound wherein the primary amino alcohol is represented by the formula:

wherein each of R1 and R2 is independently selected from the group consisting of R′O—, R′OO— and HO—CH 2 — where each R′ is hydrogen or a hydrocarbyl group containing 1 to 20 carbon atoms.

16. A curing composition for an epoxy resin composition comprising a primary amino alcohol physically blended, without the formation of a reaction product, with a curing agent, wherein the primary amino alcohol is represented by the formula:

wherein each of R1 and R2 is independently selected from the group consisting of R′S—, R′ 2 N—, R′ 2 P—, and R′ 3 Si— where each R′ is hydrogen or a hydrocarbyl group containing 1 to 20 carbon atoms.

17. A curing composition for an epoxy resin composition, wherein the curing composition comprises a primary amino alcohol physically blended, without the formation of a reaction product, with a curing agent, wherein the primary amino alcohol is selected from the group consisting of 2-amino-1-butanol, 2-amino-2-methyl-1,3-propanediol, 2-amino-2-methyl-1-propanol, 2-amino-2-ethyl-1,3-propanediol, 2-amino-3-methyl-1-butanol, 2-amino-1-hexanol, tris(hydroxymethyl)aminomethane and combinations thereof.

18. An epoxy resin composition comprising an epoxy resin and a curing composition, wherein the curing composition comprises a primary amino alcohol physically blended, without the formation of a reaction product, with a curing agent, wherein the primary amino alcohol is selected from the group consisting of 2-amino-1-butanol, 2-amino-2-methyl-1,3-propanediol, 2-amino-2-methyl-1-propanol, 2-amino-2-ethyl-1,3-propanediol, 2-amino-3-methyl-1-butanol, 2-amino-1-hexanol, tris(hydroxymethyl)aminomethane and combinations thereof.

19. The epoxy resin composition of claim 18 wherein the epoxy resin composition is a powder coating composition.

20. The epoxy resin composition of claim 18 wherein the curing agent comprises dicyandiamide.

Assignments (29)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2022
From: HEXION INC.
To: WESTLAKE EPOXY INC.
Reel/Frame 061611/0876 →
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS (TERM LOAN) Recorded Feb 1, 2022
From: JPMORGAN CHASE BANK, N.A.
To: HEXION INC.
Reel/Frame 058932/0923 →
PARTIAL TERMINATION AND RELEASE OF SECURITY INTEREST IN SPECIFIED PATENTS (ABL) Recorded Feb 1, 2022
From: JPMORGAN CHASE BANK, N.A.
To: HEXION INC.
Reel/Frame 058932/0915 →
PATENT SECURITY INTEREST (ABL) Recorded Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049740/0770 →
PATENT SECURITY INTEREST (TERM LOAN) Recorded Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049741/0425 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (030146/0970) Recorded Jul 9, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS MOMENTIVE SPECIALTY CHEMICALS INC.)
Reel/Frame 049706/0264 →
PATENT SECURITY INTEREST ASSIGNMENT AGREEMENT Recorded Apr 3, 2019
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS THE PRIOR COLLATERAL AGENT
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS THE CURRENT COLLATERAL AGENT
Reel/Frame 048788/0617 →
RELEASE OF SECURITY INTEREST Recorded Feb 23, 2017
From: WILMINGTON TRUST, NATIONAL ASSOCIATION (SUCCESSOR BY MERGER TO WILMINGTON TRUST FSB), AS COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS HEXION SPECIALTY CHEMICALS INC.); BORDEN CHEMICAL FOUNDRY, LLC; HEXION INVESTMENTS INC. (FORMERLY KNOWN AS BORDEN CHEMICAL INVESTMENTS, INC.); HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; HEXION INTERNATIONAL INC. (FORMERLY KNOWN AS BORDEN CHEMICAL INTERNATIONAL INC.); OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
Reel/Frame 041793/0001 →
SECURITY INTEREST Recorded Feb 13, 2017
From: HEXION INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 041693/0888 →
RELEASE OF SECURITY INTEREST Recorded Jul 15, 2016
From: WILMINGTON TRUST COMPANY
To: HEXION INC.
Reel/Frame 039360/0724 →
CHANGE OF NAME Recorded Feb 3, 2015
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: HEXION INC.
Reel/Frame 034882/0816 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 030146/0946 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE SPECIALTY CHEMICALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030146/0970 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Mar 28, 2013
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE SPECIALTY CHEMICALS INC. (F/K/A HEXION SPECIALTY CHEMICALS, INC.)
Reel/Frame 030111/0021 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME PREVIOUSLY RECORDED ON REEL 027805, FRAME 0642. Recorded Apr 19, 2012
From: RESOLUTION PERFORMANCE PRODUCTS CORP
To: HEXION SPECIALTY CHEMICALS, INC.
Reel/Frame 028078/0190 →
CERTIFICATE OF CONVERSION Recorded Mar 5, 2012
From: RESOLUTION PERFORMANCE PRODUCTS LLC
To: RESOLUTION PERFORMANCE PRODUCTS CORP
Reel/Frame 027805/0621 →
MERGER Recorded Mar 5, 2012
From: RESOLUTION PERFORMANCE PRODUCTS CORP
To: N SPECIALTY CHEMICALS, INC.
Reel/Frame 027805/0642 →
CHANGE OF NAME Recorded Mar 5, 2012
From: HEXION SPECIALTY CHEMICALS, INC.
To: MOMENTIVE SPECIALTY CHEMICALS INC.
Reel/Frame 027805/0802 →
SECURITY AGREEMENT Recorded Feb 5, 2010
From: HEXION LLC; HEXION SPECIALTY CHEMICALS, INC.; BORDEN CHEMICAL FOUNDRY, LLC; BORDEN CHEMICAL INVESTMENTS, INC.; HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; BORDEN CHEMICAL INTERNATIONAL, INC.; OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 023905/0451 →
SECURITY INTEREST Recorded Jan 29, 2010
From: HEXION SPECIALTY CHEMICALS, INC.; BORDEN CHEMICAL FOUNDRY, LLC; BORDEN CHEMICAL INVESTMENTS, INC.; HEXION U.S. FINANCE CORP.; HSC CAPITAL CORPORATION; LAWTER INTERNATIONAL INC.; BORDEN CHEMICAL INTERNATIONAL, INC.; OILFIELD TECHNOLOGY GROUP, INC.; HEXION CI HOLDING COMPANY (CHINA) LLC
To: WILMINGTON TRUST FSB, AS COLLATERAL AGENT
Reel/Frame 023963/0038 →
RELEASE OF SECURITY INTEREST Recorded Jan 28, 2010
From: GENERAL ELECTRIC CAPITAL CORPORATION
To: RESOLUTION PERFORMANCE PRODUCTS LLC
Reel/Frame 023861/0751 →
SECURITY AGREEMENT Recorded Nov 21, 2006
From: HEXION SPECIALTY CHEMICALS, INC.
To: WILMINGTON TRUST COMPANY, AS COLLATERAL AGENT
Reel/Frame 018535/0701 →
SECURITY AGREEMENT Recorded Nov 21, 2006
From: HEXION SPECIALTY CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 018535/0556 →
SECURITY AGREEMENT Recorded Jul 14, 2006
From: HEXION SPECIALTY CHEMICALS, INC.
To: JPMORGAN CHASE BANK, N.A. AS COLLATERAL AGENT
Reel/Frame 017946/0151 →
SECURITY AGREEMENT Recorded Aug 31, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC; RESOLUTION SPECIALTY MATERIALS LLC; BORDEN CHEMICAL, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016480/0648 →
SECURITY AGREEMENT Recorded Aug 31, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC; RESOLUTION SPECIALTY MATERIALS LLC; BORDEN CHEMICAL, INC.
To: WILMINGTON TRUST COMPANY, AS COLLATERAL AGENT
Reel/Frame 016522/0428 →
SECURITY AGREEMENT Recorded Jan 25, 2005
From: RESOLUTION PERFORMANCE PRODUCTS LLC
To: GENERAL ELECTRIC CAPITAL CORPORATION, AS COLLATERAL AGENT
Reel/Frame 015596/0703 →
RELEASE OF PATENT SECURITY AGREEMENT Recorded Jan 25, 2005
From: MORGAN STANLEY & CO., INCORPORATED
To: RESOLUTION PERFORMANCE PRODUCTS LLC
Reel/Frame 015603/0117 →
SECURITY INTEREST Recorded Jul 14, 2003
From: RESOLUTION PERFORMANCE PRODUCTS LLC
To: MORGAN STANLEY & CO., INCORPORATED
Reel/Frame 014268/0341 →