Patent Assignment
Reel/Frame 034882/0816
Change of Name
Recorded: 2015-02-03
Pages: 5
Assignor
MOMENTIVE SPECIALTY CHEMICALS INC.
Executed: 2015-01-15
Assignee
HEXION INC.
180 EAST BROAD STREET, COLUMBUS, OHIO, 43215
Covered Properties
(61)
Stable Waterborne Epoxy Resin Dispersion Containing Micronized Dicy
Patent:
5,500,461 →
Application:
08/424,846 →
Amine-Terminated Polyamine in Oil-in-Water Emulsion
Patent:
5,962,629 →
Application:
08/558,357 →
Epoxy Resin Composition for Semiconductor Encapsulation
Patent:
5,739,186 →
Application:
08/566,574 →
Mannich Base Curing Agents
Patent:
5,569,536 →
Application:
08/572,199 →
Modified Liquid Epoxy Resin Composition
Patent:
5,623,031 →
Application:
08/585,380 →
Epoxy Resin Composition Containing Novolac with Adjacent Hydroxyl Groups
Patent:
5,597,876 →
Application:
08/625,839 →
Anisotropic Conductive Adhesive Compositions
Patent:
5,840,215 →
Application:
08/768,055 →
Epoxy Resin and Amine-Terminated Polyamide from Aminoalylpiperazine
Patent:
6,127,508 →
Application:
08/859,518 →
Polyepoxy Composition Containing Trisepoxide
Patent:
5,880,246 →
Application:
08/889,605 →
Aqueous Dispersions of Epoxy Resins
Patent:
5,741,835 →
Application:
08/896,118 →
Coating or Impregnant of Epoxy Resin and Aqueous Polyamide-Amine Dispersion
Patent:
6,013,757 →
Application:
08/977,977 →
Aqueous Dispersions of Polyamide-Amine Derived from Aminoalkylpiperazine with Epoxy Resin
Patent:
5,998,508 →
Application:
08/978,073 →
Epoxy Resin Composition
Patent:
5,900,468 →
Application:
09/032,892 →
Epoxy Resin Composition
Patent:
6,084,039 →
Application:
09/033,963 →
Epoxy Resin Composition and Cured Composite Product
Patent:
6,005,060 →
Application:
09/063,750 →
Epoxy Resin Composition and Epoxy Resin Composition for Encapsulating Semiconductors
Patent:
6,063,876 →
Application:
09/085,209 →
Epoxy-Functional Amidoamine Reacted with Excess Polyamine and Monoepoxy as Epoxy Curative
Patent:
6,277,928 →
Application:
09/095,079 →
Epoxy Resin Curing Agent-Reacting Acid-Terminated Polyalkylene Glycol with Excess Amine-Terminated Polyamine-Epoxy Resin Adduct
Patent:
6,127,459 →
Application:
09/095,090 →
Process to Prepare Aqueous Dispersions of Epoxy Resins
Patent:
6,143,809 →
Application:
09/116,922 →
Aqueous Dispersions of Epoxy Resins
Patent:
6,221,934 →
Application:
09/116,923 →
Waterproofing Membrane from Epoxy Resin and Amine-Terminated Polyamide
Patent:
6,395,845 →
Application:
09/212,083 →
Partial Oxidation of Polyoxyalkylene Polyol Compositions to Polycarboxylic Acid Compositions
Patent:
6,235,931 →
Application:
09/223,549 →
Epoxy Resin Composition for Semiconductor Encapsulation
Patent:
6,255,365 →
Application:
09/360,963 →
Acid Functional Polyester Resins and Lower Temperature Curable Powder Coating Compositions Comprising Them
Patent:
6,187,875 →
Application:
09/421,168 →
Aqueous Epoxy Resin System with Curing Agent from Reacting Acid-Terminated Polyalkylene Glycol with Epoxy-Amine Adduct
Patent:
6,136,894 →
Application:
09/443,871 →
Adhesive of Epoxy Resin, Amine-Terminated Polyamide and Polyamine
Patent:
6,136,944 →
Application:
09/449,870 →
Epoxy resin system
Patent:
6,274,682 →
Application:
09/490,522 →
Process for Producing Phenol-Dicarbonyl Condensates with Increased Fluorescence, Epoxy Resins, Epoxy Resin Systems and Laminates Made with the Same
Patent:
6,608,161 →
Application:
09/518,506 →
Suppressing Staining of Coating Coating Baking Ovens
Patent:
6,372,295 →
Application:
09/525,138 →
Process for the Preparation of Ketimine Curing Agents
Patent:
6,573,357 →
Application:
09/602,398 →
Polyamine / Epoxy-Functional Amidoamine Product with Epoxy Resin
Patent:
6,359,037 →
Application:
09/635,909 →
Epoxy Resin System
Patent:
6,500,912 →
Application:
09/660,369 →
Acid functional and epoxy functional polyester resins
Patent:
6,388,024 →
Application:
09/696,577 →
Water Dispersible Epoxy Resins
Attachment of Surface Mount Devices to Printed Circuit Boards Using a Thermoplastic Adhesive
Modified Epoxy Resin Composition, Production Process for the Same and Solvent-Free Coating Comprising the Same
Curing Agent for Epoxy Resins and Epoxy Resin Composition
Epoxy Resin Curing Compositions and Resin Compositions Including Same
Epoxy Resin Curing Agent of Epoxy Resin-Liquid Amine Adduct and Polyamidoamine
System for Treating an Underground Formation
Epoxy Resin Compositions, Processes Utilizing Same and Articles Made Therefrom
Water Dispersible Epoxy Resins
Compositions Useful for Preparing Composites and Composites Produced Therewith
Epoxy Resin Curing Compositions and Epoxy Resin Systems Including Same
Epoxy Resin Curing Compositions and Epoxy Resin Systems Including Same
Compositions Useful for Non-Cellulose Fiber Sizing, Coating or Binding Compositions, and Composites Incorporating Same
Epoxy-Phenolic Resins Co-Dispersions
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Coated Reinforcement and Method for Producing Same
Epoxy Systems for Composites
Application:
13/160,964 →
Publication:
US 2011/0319564
Coated Reinforcement
Application:
13/387,643 →
Publication:
US 2012/0164900
Compositions Useful for Preparing Composites and Composites Produced Therewith
Manufacture of an Epoxyethyl Ethers or Glycidyl Ethers
Storage Stable Water Based Epoxy-Amine Curable Systems
Flame Resistant Composite Structure
Application:
13/938,855 →
Publication:
US 2014/0023867
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Composites and Epoxy Resins Based on Aryl Substituted Compounds
Blends of Liquid Epoxy and Solid Phenoxy Resins
Curing Agent for Epoxy Coatings
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest
Jul 15, 2016
From: WILMINGTON TRUST COMPANY
To: HEXION INC.
Reel/Frame 039360/0724 →
Security Interest
Feb 13, 2017
From: HEXION INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 041693/0888 →
Release of Security Interest
Feb 23, 2017
From: WILMINGTON TRUST, NATIONAL ASSOCIATION (SUCCESSOR BY MERGER TO WILMINGTON TRUST FSB), AS COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS HEXION SPECIALTY CHEMICALS INC.); BORDEN CHEMICAL FOUNDRY, LLC; HEXION INVESTMENTS INC. (FORMERLY KNOWN AS BORDEN CHEMICAL INVESTMENTS, INC.); HEXION U.S. FINANCE CORP.
Reel/Frame 041793/0001 →
Patent Security Interest Assignment Agreement
Apr 3, 2019
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS THE PRIOR COLLATERAL AGENT
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS THE CURRENT COLLATERAL AGENT
Reel/Frame 048788/0617 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (030146/0970)
Jul 9, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS MOMENTIVE SPECIALTY CHEMICALS INC.)
Reel/Frame 049706/0264 →
Patent Security Interest (Term Loan)
Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049741/0425 →
Patent Security Interest (Abl)
Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049740/0770 →
Release of Security Interest in Patents (Term Loan) Recorded at Reel/Frame 049741/0425
Mar 18, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HEXION INC.
Reel/Frame 059435/0473 →
Release of Security Interest in Patents (Abl) Recorded at Reel/Frame 049740/0770
Mar 18, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: HEXION INC.
Reel/Frame 059435/0490 →