Epoxy resin curing compositions and epoxy resin systems including same
View Patent ↗Disclosed are epoxy resins exhibiting a highly favorable combination of tensile strength and elongation with respect to prior art epoxy systems. The elastomeric epoxy resin systems of the invention are prepared utilizing a curing agent containing at least one monoprimary amine, and are particularly useful in applications such as, for example, castings, potting, composites, crack sealing, coatings, adhesives, roofing materials, flooring or reinforced membranes.
1. A composition comprising an epoxy resin system, the epoxy resin system comprising a reaction product of:
an epoxy resin component; and
a curing agent comprising:
a monoprimary amine represented by any one of the formulae R′—O—R—NH 2 , R′S—R—NH 2 , R′ 2 N—R—NH 2 , R′ 2 P—R—NH 2 , or R′ 3 Si—RNH 2 wherein each of R or R′ is independently a hydrocarbyl group such that a combination of R plus all R′ groups contains a total of between about 8 and about 50 carbon atoms; and
an adduct of a polyepoxide and a compound having two or more primary amine moieties linked to a common central organic moiety;
wherein when cured, the reaction product of the epoxy resin component and the curing agent exhibits a tensile strength of >1 MPa, and an elongation of >100% as measured by ASTM D-368 at 25° C.
2. The composition of claim 1 wherein the curing agent further comprises an amine terminated polyamide which is the reaction product of a dimerized fatty acid or hydrogenated dimerized fatty acid with an amine containing one primary and one secondary amine group or two secondary amine groups.
3. The composition of claim 2 wherein the amine terminated polyamide is prepared by reacting:
(a) carboxylic acids selected from C 18 -C 60 dicarboxylic acids, C 18 -C 60 dicarboxylic acid derivatives and mixtures thereof, wherein the carboxylic acids optionally contain di- or polycarboxylic acids or acid derivatives having from 4 to 20 carbon atoms in an amount ranging from 0-10% based on all carboxylic acids; and
(b) at least one amine having the formula:
R 1 —NH—R 2 —NH—R 3
wherein R 1 has a total number of carbon atoms from 0 to about 20 and is selected from the group consisting of hydrogen, alkyl, cycloalkyl, alkenyl, arylalkyl, hydroxyalkyl, alkoxyalkyl, cyanoalkyl, alkylthioalkyl, dialkylaminoalkyl, aryl, alkylaryl, cyanoaryl, alkoxyaryl, alkylthioaryl, and dialkylaminoaryl;
R 3 has a total number of carbon atoms from 1 to about 20 and is selected from the group consisting of alkyl, cycloalkyl, alkenyl, arylalkyl, hydroxyalkyl, alkoxyalkyl, cyanoalkyl, alkylthioalkyl, dialkylaminoalkyl, aryl, alkylaryl, cyanoaryl, alkoxyaryl, alkylthioaryl, and dialkylaminoaryl; and
R 2 is (CR 4 R 5 ) n , wherein n is from 2 to about 20, R 4 is independently selected for each (CR 4 R 5 ) from the group consisting of H, alkyl, aryl, hydroxyl, alkoxy, alkylthio, dialkylamino and cyano; and R 5 is independently selected for each (CR 4 R 5 ) from the group consisting of H, alkyl and aryl.
4. The composition of claim 2 wherein the amine terminated polyamide is prepared by reacting:
at least one C 18 -C 50 dicarboxylic acid, dicarboxylic acid ester or dicarboxylic acid chloride with an aminoalkylpiperazine having the formula:
wherein R 1 is hydrogen and R 2 is —R 3 —NH 2 wherein R 3 is a divalent aliphatic linkage with optional —CHR 4 and —CR 4 R 5 units, wherein R 4 and R 5 are independently alkyl groups.
5. The composition of claim 1 wherein the monoprimary amine is represented by the formula R′—O—R—NH 2 wherein each of R or R′ is independently a hydrocarbyl group such that a combination of R plus R′ contains a total of between about 8 and about 50 carbon atoms.
6. The composition of claim 1 wherein the monoprimary amine is represented by the formula R′ 2 N—R—NH 2 wherein each of R or R′ is independently a hydrocarbyl group such that a combination of R plus both R′ groups contains a total of between about 8 and about 50 carbon atoms.
7. The composition of claim 1 wherein the compound having two or more primary amine moieties linked to a common central organic moiety may comprise an amine compound selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyglycoldiamines, polyoxypropylene diamines, polyoxypropylenetriamines, araliphatic polyamines, heterocyclic amines, aromatic polyamines, and combinations thereof, having two or more primary amine moieties linked to a common central organic moiety.
8. The composition of claim 1 wherein the epoxy resin system further comprises a monofunctional or polyfunctional epoxy diluent.
9. The composition of claim 1 wherein the epoxy resin system further comprises a polyacrylate or polymethacrylate ester of a polyol.
10. The composition of claim 1 wherein the epoxy resin system further comprises an accelerator.
11. The composition of claim 10 wherein the accelerator comprises a compound selected from the group of alkylbenzenesulfonates, phosphonates, sulfates, tetrafluoroborates, carboxylates and nitrates of Groups IA, IIA and transition metals of the Periodic Table, inorganic acids, carboxylic acids, phenolic compounds, imidazoles, cyanamide compounds, sulfonamides, imides, and combinations thereof.
12. The composition of claim 1 wherein the composition is free of asphalt.
13. The composition of claim 1 wherein the monoprimary amine comprises one or more amines selected from the group consisting of octyl 3-aminopropyl ether, 2-ethylhexyl 3-aminopropyl ether, lauryl 3-aminopropyl ether, myristyl 3-aminopropyl ether, stearyl 3-aminopropyl ether, oleyl 3-aminopropyl ether, behenyl 3-aminopropyl ether and tridecyl 3-aminopropyl ether (linear or branched) and combinations thereof.
14. The composition of claim 1 wherein the curing agent has a Brookfield viscosity of 3000 cP or less at 25° C.
15. The composition of claim 1 wherein, when cured, the reaction product of the epoxy resin component and the curing agent exhibits a Tg below 30° C. as measured by Differential Scanning calorimetry.
16. The composition of claim 2 , wherein, when cured, the reaction product of the epoxy resin component and the curing agent exhibits a T g below 30° C. as measured by Differential Scanning calorimetry.