IP Library Assignment 058932/0923
Patent Assignment
Reel/Frame 058932/0923

Partial Termination and Release of Security Interest in Patents (Term Loan)

Recorded: 2022-02-01 Pages: 8
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2022-02-01
Assignee
HEXION INC.
180 EAST BROAD STREET, ATTENTION: MARK BIDSTRUP, TREASURER, COLUMBUS, OHIO, 43215
Covered Properties (38)
Attachment of Surface Mount Devices to Printed Circuit Boards Using a Thermoplastic Adhesive
Patent: 6,906,425 →
Application: 10/091,086 →
Publication: US 2003/0170444
Modified Epoxy Resin Composition, Production Process for the Same and Solvent-Free Coating Comprising the Same
Patent: 6,677,426 →
Application: 10/145,829 →
Publication: US 2003/0045650
Curing Agent for Epoxy Resins and Epoxy Resin Composition
Patent: 6,881,799 →
Application: 10/250,612 →
Publication: US 2004/0054119
Epoxy Resin Curing Compositions and Resin Compositions Including Same
Patent: 7,001,938 →
Application: 10/351,903 →
Publication: US 2004/0147690
Epoxy Resin Curing Agent of Epoxy Resin-Liquid Amine Adduct and Polyamidoamine
Patent: 7,358,312 →
Application: 10/487,318 →
Publication: US 2004/0242835
System for Treating an Underground Formation
Patent: 7,073,586 →
Application: 10/507,301 →
Publication: US 2005/0092492
Epoxy Resin Compositions, Processes Utilizing Same and Articles Made Therefrom
Patent: 7,592,067 →
Application: 10/667,648 →
Publication: US 2005/0065295
Water Dispersible Epoxy Resins
Patent: 6,956,086 →
Application: 10/671,224 →
Publication: US 2004/0063901
Compositions Useful for Preparing Composites and Composites Produced Therewith
Patent: 8,173,745 →
Application: 12/639,726 →
Publication: US 2011/0144272
Epoxy Resin Curing Compositions and Epoxy Resin Systems Including Same
Patent: 8,796,391 →
Application: 12/642,343 →
Publication: US 2011/0152468
Epoxy Resin Curing Compositions and Epoxy Resin Systems Including Same
Patent: 9,840,588 →
Application: 12/642,420 →
Publication: US 2011/0152448
Compositions Useful for Non-Cellulose Fiber Sizing, Coating or Binding Compositions, and Composites Incorporating Same
Patent: 8,791,195 →
Application: 12/713,791 →
Publication: US 2010/0222480
Epoxy-Phenolic Resins Co-Dispersions
Patent: 8,354,475 →
Application: 12/740,169 →
Publication: US 2010/0267887
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Patent: 8,586,704 →
Application: 12/966,616 →
Publication: US 2012/0149804
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Patent: 8,580,871 →
Application: 12/966,709 →
Publication: US 2012/0149805
Process for the Manufacture of a 1,2-Epoxide
Patent: 8,729,282 →
Application: 13/056,793 →
Publication: US 2011/0137054
Process for the Manufacture of Epichlorohydrin
Patent: 8,802,873 →
Application: 13/056,835 →
Publication: US 2011/0137055
Coated Reinforcement and Method for Producing Same
Patent: 9,957,410 →
Application: 13/131,217 →
Publication: US 2011/0305907
Compositions Useful for Preparing Composites and Composites Produced Therewith
Patent: 8,445,590 →
Application: 13/442,695 →
Publication: US 2012/0264870
Manufacture of an Epoxyethyl Ethers or Glycidyl Ethers
Patent: 9,145,378 →
Application: 13/574,704 →
Publication: US 2012/0330041
Storage Stable Water Based Epoxy-Amine Curable Systems
Patent: 9,221,959 →
Application: 13/580,568 →
Publication: US 2013/0072597
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Patent: 9,234,077 →
Application: 14/060,944 →
Publication: US 2014/0046001
Epoxy Systems and Amine Polymer Systems and Methods for Making the Same
Patent: 9,234,116 →
Application: 14/061,002 →
Publication: US 2014/0051784
Process for the Manufacture of a 1,2-Epoxide
Patent: 9,199,951 →
Application: 14/223,794 →
Publication: US 2014/0296545
Composites and Epoxy Resins Based on Aryl Substituted Compounds
Patent: 9,499,692 →
Application: 14/275,093 →
Publication: US 2014/0336339
Process for the Manufacture of Epichlorohydrin
Patent: 9,227,947 →
Application: 14/285,124 →
Publication: US 2014/0256968
Blends of Liquid Epoxy and Solid Phenoxy Resins
Application: 14/374,824 →
Publication: US 2015/0037561
Epoxy Resins and Silane Aqueous Co-Dispersions and the Uses Thereof
Patent: 9,404,014 →
Application: 14/418,723 →
Publication: US 2015/0267074
Curing Agent for Epoxy Coatings
Patent: 9,550,912 →
Application: 14/576,848 →
Publication: US 2016/0177125
Silane Functionalized Compounds and Compositions Thereof
Application: 14/863,054 →
Publication: US 2016/0090439
Epoxy Systems for Composites
Patent: 9,751,973 →
Application: 15/060,411 →
Publication: US 2016/0244552
Composites and Epoxy Resins Based on Aryl Substituted Compounds
Application: 15/336,503 →
Publication: US 2017/0051119
Curing Agent for Epoxy Coatings
Application: 15/381,554 →
Publication: US 2017/0137664
Composition Comprising a Polymer Based on Epoxide Compounds
Application: 15/617,781 →
Publication: US 2017/0355848
Epoxy Systems for Composites
Patent: 9,920,161 →
Application: 15/674,060 →
Publication: US 2017/0335050
Process for Preparing Epoxy Resins
Application: 15/702,401 →
Publication: US 2019/0077906
Epoxy Resin Systems for Composites
Application: 16/000,277 →
Publication: US 2018/0355096
Epoxy Resin Systems
Application: 16/126,612 →
Publication: US 2019/0077905
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Feb 13, 2017
From: HEXION INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 041693/0888 →
Patent Security Interest Assignment Agreement Apr 3, 2019
From: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS THE PRIOR COLLATERAL AGENT
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS THE CURRENT COLLATERAL AGENT
Reel/Frame 048788/0617 →
Release of Security Interest in Patents Previously Recorded at Reel/Frame (030146/0970) Jul 9, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
To: HEXION INC. (FORMERLY KNOWN AS MOMENTIVE SPECIALTY CHEMICALS INC.)
Reel/Frame 049706/0264 →
Patent Security Interest (Abl) Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049740/0770 →
Patent Security Interest (Term Loan) Jul 12, 2019
From: HEXION INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 049741/0425 →
Partial Termination and Release of Security Interest in Specified Patents (Abl) Feb 1, 2022
From: JPMORGAN CHASE BANK, N.A.
To: HEXION INC.
Reel/Frame 058932/0915 →
Assignment of Assignor's Interest Sep 17, 2022
From: HEXION INC.
To: WESTLAKE EPOXY INC.
Reel/Frame 061611/0876 →