Granted Patent B2

US 10,040,914 · App. 15/336,503 · Granted Aug 7, 2018

Abstract

Claims (13)

1. A composite, comprising:

an epoxy resin composition comprising:

an epoxy resin component; and

a curing agent component comprising an aryl substituted phenolic compound with the aryl substituent free of active hydrogen groups; and

a substrate, wherein the aryl substituted phenolic compound is selected from the group consisting of an arylhydroquinone with the aryl group free of active hydrogen groups, an arylresorcinol with the aryl group free of active hydrogen groups, and combinations thereof.

2. The composite of claim 1 , wherein the aryl substituted phenolic compound is selected from the group of 4-phenylresorcinol, 5-phenylresorcinol, 2-phenylhydroquinone, 2,5-diphenylhydroquinone, and combinations thereof.

3. The composite of claim 1 , wherein the epoxy resin composition comprises:

from about 10 wt. % to about 95 wt. % of the epoxy resin component; and

from about 90 wt. % to about 5 wt. % of the curing agent component, wherein the total component wt. % comprises 100 wt. %.

4. The composite of claim 1 , wherein the epoxy resin component is free of a glycidyl ether of an aryl substituted phenolic compound with the aryl substituent free of an epoxy containing substituent.

5. The composite of claim 1 , wherein the curing agent component further comprises an amine-containing component.

6. The composite of claim 1 , wherein the epoxy resin component comprises from about 10 vol. % to 99.5 vol. % of the composite.

7. The composite of claim 1 , wherein the substrate comprises a reinforcing fiber substrate.

Assignments (11)