Patent Assignment
Reel/Frame 015603/0117
Release of Patent Security Agreement
Recorded: 2005-01-25
Received: 2005-01-25
Pages: 14
Assignor
MORGAN STANLEY & CO., INCORPORATED
Executed: 2005-01-20
Assignee
RESOLUTION PERFORMANCE PRODUCTS LLC
1600 SMITH STREET, 24TH FLOOR, ATTN: VICE PRESIDENT AND GENERAL COUNSEL, HOUSTON, TX, 77002, UNITED STATES
Covered Properties
(15)
Epoxy Resin Curing Agent of Epoxy Resin-Liquid Amine Adduct and Polyamidoamine
Application:
10/487,318 →
Process for the Manufacture of Glycidylester Compositions
Application:
10/840,115 →
Water Dispersible Epoxy Resins
Application:
10/671,224 →
Epoxy Resin Compositions, Processes Utilizing Same and Articles Made Therefrom
Application:
10/667,648 →
Method and Device for Producing a Shaped Body
Application:
10/468,505 →
Epoxy resin composition for semiconductor encapsulation
Application:
10/250,605 →
Curing Agent for Epoxy Resins and Epoxy Resin Composition
Application:
10/250,612 →
Controller for a Hydraulic Press and Method for the Operation Thereof
Application:
10/380,887 →
Epoxy Resin Curing Compositions and Resin Compositions Including Same
Application:
10/351,903 →
Epoxy resin compositions, methods of preparing, and articles made therefrom
Application:
10/349,673 →
Glycidyl Ester of Cooh Polyester and Curing Agent
Application:
10/219,681 →
Modified Epoxy Resin Composition, Production Process for the Same and Solvent-Free Coating Comprising the Same
Application:
10/145,829 →
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
Application:
10/091,262 →
Attachment of Surface Mount Devices to Printed Circuit Boards Using a Thermoplastic Adhesive
Application:
10/091,086 →
Composition of Epoxy Resin and Triazine-Formaldehyde-Phenol Resin
Application:
09/784,624 →