Security Agreement

Recorded: 2005-01-25 Received: 2005-01-25 Pages: 13

Assignor

Executed: 2005-01-24

Assignee

335 MADISON AVENUE, ATTN: RPP ACCOUNT OFFICER, NEW YORK, NY, 10017, UNITED STATES

Covered Properties (13)

Epoxy Resin Curing Agent of Epoxy Resin-Liquid Amine Adduct and Polyamidoamine

Application: 10/487,318 →

Process for the Manufacture of Glycidylester Compositions

Application: 10/840,115 →

Water Dispersible Epoxy Resins

Application: 10/671,224 →

Epoxy Resin Compositions, Processes Utilizing Same and Articles Made Therefrom

Application: 10/667,648 →

Epoxy resin composition for semiconductor encapsulation

Application: 10/250,605 →

Curing Agent for Epoxy Resins and Epoxy Resin Composition

Application: 10/250,612 →

Epoxy Resin Curing Compositions and Resin Compositions Including Same

Application: 10/351,903 →

Epoxy resin compositions, methods of preparing, and articles made therefrom

Application: 10/349,673 →

Glycidyl Ester of Cooh Polyester and Curing Agent

Application: 10/219,681 →

Modified Epoxy Resin Composition, Production Process for the Same and Solvent-Free Coating Comprising the Same

Application: 10/145,829 →

Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

Application: 10/091,262 →

Attachment of Surface Mount Devices to Printed Circuit Boards Using a Thermoplastic Adhesive

Application: 10/091,086 →

Composition of Epoxy Resin and Triazine-Formaldehyde-Phenol Resin

Application: 09/784,624 →