Patent Assignment
Reel/Frame 014298/0576
Assignment of Assignor's Interest
Recorded: 2003-07-02
Pages: 2
Assignee
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property
(1)
Method for Reducing Stress Concentrations on a Semiconductor Wafer by Surface Laser Treatment Including the Backside