IP Library › Assignment 014312/0104
Patent Assignment
Reel/Frame 014312/0104

Assignment of Assignor's Interest

Recorded: 2003-07-17 Pages: 3
Assignor
HIROYUKI, SUWA
Executed: 2003-05-26
Assignee
FANUC LTD.
3580, SHIBOKUSA AZA-KOMANBE, OSHINO-MURA, MINAMITSURU-GUN, YAMANASHI, 401-0597, JAPAN
Covered Property (1)
Semiconductor Chip Which Combines Bulk and Soi Regions and Separates Same with Plural Isolation Regions.
Patent: 6,878,000 →
Application: 10/623,106 →
Publication: US 2004/0067669
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 17, 2003
From: AKASAKA, JUNYA
To: TYCO ELECTRONICS AMP K.K.
Reel/Frame 014312/0101 →
Corrective Assignment to Correct the Assignor Name, Previously Recorded on Reel 014312 Frame 0104. Apr 12, 2004
From: SUWA, HIROYUKI
To: FANUC LTD.
Reel/Frame 015200/0151 →
Change of Name Nov 5, 2010
From: TYCO ELECTRONICS AMP K.K.
To: TYCO ELECTRONICS JAPAN G.K.
Reel/Frame 025325/0675 →