Patent Assignment
Reel/Frame 015200/0151
Corrective Assignment to Correct the Assignor Name, Previously Recorded on Reel 014312 Frame 0104.
Recorded: 2004-04-12
Pages: 4
Assignor
SUWA, HIROYUKI
Executed: 2003-05-26
Assignee
FANUC LTD.
3580, SHIBOKUSA AZA-KOMANBE, OSHINO-MURA, MINAMITSURU-GUN, YAMANASHI, 401-0597, JAPAN
Covered Property
(1)
Semiconductor Chip Which Combines Bulk and Soi Regions and Separates Same with Plural Isolation Regions.
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 17, 2003
From: AKASAKA, JUNYA
To: TYCO ELECTRONICS AMP K.K.
Reel/Frame 014312/0101 →
Assignment of Assignor's Interest
Jul 17, 2003
From: HIROYUKI, SUWA
To: FANUC LTD.
Reel/Frame 014312/0104 →
Change of Name
Nov 5, 2010
From: TYCO ELECTRONICS AMP K.K.
To: TYCO ELECTRONICS JAPAN G.K.
Reel/Frame 025325/0675 →