Patent Assignment
Reel/Frame 014323/0954
Assignment of Assignor's Interest
Recorded: 2003-07-23
Pages: 3
Assignors
KOH, KWANG-OK
Executed: 2003-07-08
KWAK, KUN-HO
Executed: 2003-07-08
HWANG, BYUNG-JUN
Executed: 2003-07-08
KIM, HAN-SOO
Executed: 2003-07-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Devices Using an Etch Stop Layer