IP Library › Assignment 014328/0363
Patent Assignment
Reel/Frame 014328/0363

Assignment of Assignor's Interest

Recorded: 2003-07-23 Pages: 3
Assignor
HIRAO, SHUJI
Executed: 2003-07-22
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property (1)
Method and Apparatus for Plating Substrate
Patent: 7,217,353 →
Application: 10/624,564 →
Publication: US 2004/0079646
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 19, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 033777/0873 →
Assignment of Assignor's Interest Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
Assignment of Assignor's Interest Sep 11, 2020
From: PANNOVA SEMIC, LLC
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053755/0859 →