Patent Assignment
Reel/Frame 014346/0145
Assignment of Assignor's Interest
Recorded: 2003-08-04
Pages: 15
Assignor
LOCTITE CORPORATION
Executed: 2002-05-14
Assignee
HENKEL LOCTITE CORPORATION
1001 TROUT BROOK CROSSING, ROCKY HILL, CONNECTICUT, 06067
Covered Property
(1)
Method of Bonding Die Chip with Underfill Fluxing Composition
Patent:
6,667,194 →
Application:
10/082,278 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 28, 2014
From: HENKEL LOCTITE CORPORATION
To: HENKEL CORPORATION
Reel/Frame 032372/0423 →
Assignment of Assignor's Interest
Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034183/0611 →
Assignment of Assignor's Interest
Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0151 →