IP Library Granted Patent US 6,667,194
Granted Patent Utility
US 6,667,194 · Confirmation No. 5352

METHOD OF BONDING DIE CHIP WITH UNDERFILL FLUXING COMPOSITION

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Code Description Pages PDF
2006-05-30 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-09-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-09-08 LET. Miscellaneous Incoming Letter 2 View
2002-02-26 TRNA Transmittal of New Application 2 View
2002-02-26 SPEC Specification 43 View
2002-02-26 CLM Claims 12 View
2002-02-26 ABST Abstract 1 View
2002-02-26 DRW Drawings-only black and white line drawings 9 View
2002-02-26 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,667,194
App. No.
10/082,278
Filed
2002-02-26
Granted
2003-12-23
Art Unit
1712
PTA
-107 days