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Patent Assignment
Reel/Frame 014385/0659

Assignment of Assignor's Interest

Recorded: 2003-08-05 Pages: 2
Assignors
HUANG, CHIEN-PING
Executed: 2003-05-26
HSIAO, CHENG-HSU
Executed: 2003-05-26
Assignee
SILICONWARE PRECISION INDUSTRIES CO., INC.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG HSIEN, R.O.C., TAIWAN
Covered Property (1)
Thermally Enhanced Semiconductor Package
Patent: 7,019,406 →
Application: 10/635,168 →
Publication: US 2004/0238945