Patent Assignment
Reel/Frame 014406/0443
Assignment of Assignor's Interest
Recorded: 2004-03-08
Pages: 3
Assignor
KIMURA, MUTSUMI
Executed: 2003-11-16
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Manufacturing Circuit Board Including Transfer Chip Having a Plurality of First Pad Electrodes Connected to Wiring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.