Patent Assignment
Reel/Frame 014426/0378
Corrected Cover Sheet to Correct Inventor's Name, Previously Recorded at Reel/Frame 013290/0389 (Assignment of Assignor's Interest)
Recorded: 2004-03-12
Pages: 6
Assignors
JEUN, GI-YOUNG
Executed: 2002-08-28
PARK, SUNG-MIN
Executed: 2002-08-28
LEE, JOO-SANG
Executed: 2002-08-28
LIM, SUNG-WON
Executed: 2002-08-29
JEON , O-SEOB
Executed: 2002-08-29
LEE, BYOUNG-OK
Executed: 2002-08-29
KIM, YOUNG-GIL
Executed: 2002-08-28
YANG, GWI-GYEON
Executed: 2002-08-28
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
82-3 DODANG-DONG, WONMI-KU, PUCHON KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Package Having Improved Heat Dissipating Capability
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →