Patent Assignment
Reel/Frame 014467/0216
Assignment of Assignor's Interest
Recorded: 2003-09-04
Pages: 3
Assignor
SONG, HO UK
Executed: 2003-08-05
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICH'ON, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Device and Method for Fabricating the Same