Patent Assignment
Reel/Frame 014478/0134
Assignment of Assignor's Interest
Recorded: 2003-06-02
Pages: 2
Assignors
SATO, YUJI
Executed: 2003-05-21
YOSHINO, SHIROU
Executed: 2003-05-21
FURUKAWA, HOROSHI
Executed: 2003-05-21
MATSUYAMA, HIROYUKI
Executed: 2003-05-21
Assignee
KOMATSU DENSHI KINZOKU KABUSHIKI KAISHA
25-1, SHINOMIYA 3-CHOME, HIRABSUKA-SHI, KANAGAWA, 254-0014, STATELESS
Covered Property
(1)
Method of Heat Treatment of Silicon Wafer Doped with Boron
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.