Patent Assignment
Reel/Frame 014483/0297
Assignment of Assignor's Interest
Recorded: 2003-09-03
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
ROOM 51-103, TTSC/B100, 195 SECTION 4, CHUNG HSING ROAD, CHUTUNG, HSINCHU, 310 R.O.C., TAIWAN
Covered Property
(1)
Self-Assembled Nanometer Conductive Bumps and Method for Fabricating