Patent Assignment
Reel/Frame 014486/0994
Assignment of Assignor's Interest
Recorded: 2003-09-05
Pages: 3
Assignors
CHEN, HUEI-JEN
Executed: 2003-08-27
LIU, EVAN
Executed: 2003-08-27
CHEN, YVON
Executed: 2003-08-27
Assignee
LITE-ON SEMICONDUCTOR CORP.
9F, NO. 233-2, PAO-CHIAO RD. HSIN-TIEN, TAIPEI, R.O.C., TAIWAN
Covered Property
(1)
Method for Fabricating a Substrate, Including a Plurality of Chip Package Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.