Patent Assignment
Reel/Frame 014505/0440
Assignment of Assignor's Interest
Recorded: 2003-09-16
Pages: 5
Assignee
ANALOG DEVICES, INC.
ONE TECHNOLOGY WAY, P.O. BOX 9106, NORWOOD, MASSACHUSETTS, 02062-9106
Covered Property
(1)
Method for Direct Bonding Two Silicon Wafers for Minimising Interfacial Oxide and Stresses at the Bond Interface, and an Soi Structure