Patent Assignment
Reel/Frame 014520/0498
Assignment of Assignor's Interest
Recorded: 2003-09-17
Pages: 2
Assignors
ENDO, MITSUYOSHI
Executed: 2003-08-28
MATSUO, MIE
Executed: 2003-08-28
TAKUBO, CHIAKI
Executed: 2003-08-28
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO 105-8001, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Package Member, and Semiconductor Device Manufacturing Method