Patent Assignment
Reel/Frame 014521/0926
Assignment of Assignor's Interest
Recorded: 2003-09-22
Pages: 2
Assignors
OGASAWARA, KAZUTO
Executed: 2002-04-15
TANAKA, MITSUGU
Executed: 2002-04-15
TOMIHIRA, SEIICHI
Executed: 2002-04-15
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI HOKKAI SEMICONDUCTOR, LTD.
145, AZANAKAJIMA, NANAECHO, KAMEDA-GUN, HOKKAIDO, JAPAN
Covered Property
(1)
Manufacturing Method of a Block Molding Semiconductor Device Divided by Dicing Blade
Application:
10/157,823 →
Publication:
US 2003/0006492
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.